公开(公告)号：WO2022046566A1

公开(公告)日：2022-03-03

申请号：PCT/US2021/046985

申请日：2021-08-20

Applicant: MRSI SYSTEMS LLC

Inventor： CELIA, JR., Nicholas Samuel

IPC: H01L21/68 ,  H01L21/67

Abstract: A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.