公开(公告)号：WO2022046566A1

公开(公告)日：2022-03-03

申请号：PCT/US2021/046985

申请日：2021-08-20

Applicant: MRSI SYSTEMS LLC

Inventor： CELIA, JR., Nicholas Samuel

IPC: H01L21/68 ,  H01L21/67

Abstract: A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.

公开(公告)号：WO2020190991A1

公开(公告)日：2020-09-24

申请号：PCT/US2020/023252

申请日：2020-03-18

Applicant: MRSI SYSTEMS LLC

Inventor： CELIA, JR., Nicholas, Samuel ,  DEVASIA, Cyriac

IPC: H01L21/67 ,  H01L21/687

Abstract: A die bonding system comprising a heated bond head with the ability to heat up and cool down quickly, change tips to handle different sized dies, and load and unload tips automatically while maintaining the precision required to handle dies smaller than 200um 2 .

公开(公告)号：WO2014186337A1

公开(公告)日：2014-11-20

申请号：PCT/US2014/037800

申请日：2014-05-13

Applicant: MRSI SYSTEMS LLC

Inventor： CELIA, Jr., Nicholas Samuel ,  DEVASIA, Cyriac

IPC: H01L21/603 ,  H01L21/02

CPC classification number: H01L24/75 ,  B23K37/0408 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75267 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75901 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Co-planarity adjustment systems and methods, gantries capable of applying high force without imposing moment loads to their bearings, systems and methods for achieving rapid heating and cooling and efficient slidable seal systems capable of sealing a chamber and injecting one or more fluids into the chamber as well as actively recovering portions of such fluid which have migrated into the seal itself are disclosed in the context of thermo-compression bonding systems, apparatuses and methods, although many alternative uses will be apparent to those of skill in the art.

Abstract translation: 共面调整系统和方法，能够施加大力而不对其轴承施加力矩载荷的龙门架，用于实现快速加热和冷却的系统和方法以及能够密封腔室并将一种或多种流体注入腔室中的高效滑动密封系统 以及在热压接系统，装置和方法的上下文中公开了已经迁移到密封件中的这种流体的主动回收部分，尽管许多替代用途对于本领域技术人员将是显而易见的。

公开(公告)号：WO2022126018A1

公开(公告)日：2022-06-16

申请号：PCT/US2021/063097

申请日：2021-12-13

Applicant: MRSI SYSTEMS LLC [US]/[US]

Inventor： CAREW, Dennis ,  ORTEGA, Julius

IPC: H01L23/00

Abstract: A die bonding system uses an inert gas chamber having a bottom aperture through which a heater assembly can insert a part for bonding, a cover having a top aperture through which a die bond head can insert and bond a die to the part, and a plurality of apertures through a base of the inert gas chamber through which a forming gas is bled through to evacuate the chamber of oxygen before performing a die bonding operation, reducing the potential for oxidation while maintaining cycle times suitable for use in a production environment.

公开(公告)号：WO2017031100A1

公开(公告)日：2017-02-23

申请号：PCT/US2016/047135

申请日：2016-08-16

Applicant: MRSI SYSTEMS, LLC

Inventor： CELIA, Nicholas Samuel Jr.

IPC: H01L21/52 ,  H01L21/027 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L24/00 ,  H01L24/75

Abstract: Herein described is a system for the placement of dies on a substrate that uses a rotating turret carried with the die placement system to supply die placement heads necessary for the placement of various dies on a substrate, where multiple dies are to be placed, to a force application rod, thereby allowing for the rapid and efficient placement of a variety of dies on a single substrate.

Abstract translation: 这里描述了一种用于在基板上放置模具的系统，该系统使用带有芯片放置系统的旋转转台，以将待放置多个模具的基板上放置各种模具所需的裸片放置头提供给 从而允许将各种模具快速且有效地放置在单个基板上。

公开(公告)号：WO2023022736A1

公开(公告)日：2023-02-23

申请号：PCT/US2021/047004

申请日：2021-08-20

Applicant: MRSI SYSTEMS LLC

Inventor： CELIA, Nicholas, Samuel, Jr. ,  DEVASIA, Cyriac

IPC: H01L21/687 ,  H01L21/52

Abstract: A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.