公开(公告)号：WO2002084918A3

公开(公告)日：2002-10-24

申请号：PCT/JP2002/001494

申请日：2002-02-20

Applicant: NITTO DENKO CORPORATION ,  TACHIBANA, Katsuhiko

Inventor： TACHIBANA, Katsuhiko

IPC: C09J7/02

Abstract: A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A layer comprising a pressure-sensitive adhesive composition having a storage modulas of 20 N/cm 2 or higher is formed on a surface of a finely cellular foam to constitute a sealing material having an adhesive force of 5.0 N/20 mm width or higher.

公开(公告)号：WO2002084918A2

公开(公告)日：2002-10-24

申请号：PCT/JP2002/001494

申请日：2002-02-20

Applicant: NITTO DENKO CORPORATION ,  TACHIBANA, Katsuhiko

Inventor： TACHIBANA, Katsuhiko

IPC: H04L

CPC classification number: H05K5/061 ,  C09J7/22 ,  C09J7/26 ,  C09J7/38 ,  C09J2469/00 ,  H04M1/0266 ,  H04M1/18 ,  Y10T428/28

Abstract: A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A layer comprising a pressure-sensitive adhesive composition having a storage modulas of 20 N/cm 2 or higher is formed on a surface of a finely cellular foam to constitute a sealing material having an adhesive force of 5.0 N/20 mm width or higher.

Abstract translation: 一种用于电气/电子设备的成形密封材料，其没有灰尘颗粒附着在其上并且易于处理，尽管它是通过在泡沫上形成压敏粘合剂层而获得的密封材料。 在微细泡沫的表面上形成包含具有20N / cm 2或更高的储存模量的压敏粘合剂组合物的层，以构成粘合力为5.0N / 20mm宽的密封材料，或 更高。