Abstract:
Example apparatus provide a conductive back contact layer and methods for making the same. An example method may include (a) providing a conductive substrate having a first side and a second side, (b) applying at least one pre-reaction layer to the second side of the substrate, wherein the pre-reaction layer comprises a conductive material, (c) exposing the at least one pre-reaction layer to a selenium-or sulfur-containing vapor, and (d) applying at least one layer of conductive oxidation-resistant material to the second side.