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公开(公告)号:WO2021144142A1
公开(公告)日:2021-07-22
申请号:PCT/EP2021/000002
申请日:2021-01-12
Applicant: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON
Inventor: DRABIK, Martin , MANNINEN, Noora , ACIKGOZ DOROKIN, Canet
IPC: C23C14/06 , A61L27/30 , C04B35/58 , C23C14/14 , A61L29/16 , A61L2300/104 , A61L2420/04 , A61L27/306 , A61L27/54 , C04B2235/408 , C04B2235/80 , C04B35/58014 , C23C14/0641 , C23C14/0688
Abstract: A method for introducing a soft metal into a hard coating during a physical vapor deposition process. The method including steps of providing a substrate; depositing a bonding layer on the substrate; and depositing the hard coating on the bonding layer using vapor deposition wherein the soft metal forms islands in the hard coating.
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公开(公告)号:WO2021144142A8
公开(公告)日:2021-07-22
申请号:PCT/EP2021/000002
申请日:2021-01-12
Applicant: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON
Inventor: DRABIK, Martin , MANNINEN, Noora , ACIKGOZ DOROKIN, Canet
IPC: C23C14/06 , A61L27/30 , C04B35/58 , C23C14/14 , A61L29/16 , A61L2300/104 , A61L2420/04 , A61L27/306 , A61L27/54 , C04B2235/408 , C04B2235/80 , C04B35/58014 , C23C14/0641 , C23C14/0688
Abstract: A method for introducing a soft metal into a hard coating during a physical vapor deposition process. The method including steps of providing a substrate; depositing a bonding layer on the substrate; and depositing the hard coating on the bonding layer using vapor deposition wherein the soft metal forms islands in the hard coating.
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公开(公告)号:WO2022117704A2
公开(公告)日:2022-06-09
申请号:PCT/EP2021/083911
申请日:2021-12-02
Applicant: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON
Inventor: LINDIC, Marie-Hélène , MANNINEN, Noora , ACIKGOZ DOROKIN, Canet , DRABIK, Martin
IPC: C23C14/32 , B32B33/00 , A61L27/28 , A61L29/08 , A61L29/16 , A61L31/16 , C23C14/06 , C23C14/02 , C23C14/58 , C23C16/34 , A61L27/30 , A61L27/54 , C04B35/58 , A61L2300/102 , A61L2300/104 , A61L2300/404 , A61L2400/12 , A61L2420/08 , A61L27/306 , A61L29/106 , A61L31/088 , C23C14/024 , C23C14/027 , C23C14/0641 , C23C14/0688 , C23C14/325 , C23C14/5873
Abstract: A substrate is described with a surface wherein the surface at least comprises an area which is coated with a coating with antibacterial and/or antiviral and/or antifungal properties, characterized in, that the coating comprises an optional first layer a second layer and a preferable third layer, wherein the second layer is a hard layer comprising Ag and/or Cu wherein the optional first layer is located between the substrate body and the second layer and wherein the third layer is a top layer forming the outer surface of the area and which is tailored to allow Ag and/or Cu ions to leave the surface in a predetermined manner.
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