公开(公告)号：WO2012089275A1

公开(公告)日：2012-07-05

申请号：PCT/EP2010/070948

申请日：2010-12-30

Applicant: OPTION WIRELESS LIMITED ,  KINSELLA, Andrew

Inventor： KINSELLA, Andrew

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/145 ,  H05K1/142 ,  H05K3/4694 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/10598

Abstract: A multi board module is manufactured by forming (100) a first multilayer circuit board so as to have an aperture, providing (110) a second multilayer circuit board (50) to fit within at least part of the aperture, and inserting (120) the second multilayer circuit board into the aperture so that surfaces of the boards are coplanar. Circuit components are mounted (130) on the coplanar surfaces and in the same step, a passive component is mounted between the respective conductors across a perimeter of the aperture to form one or more electrical connections between the boards. This can avoid the need for a separate manufacturing step for the electrical connections. A lug and recess can be provided to enable the insertion to be a press fit. The second board can be thinner so that its backside is recessed and thus provide a better foundation for a glued joint.

Abstract translation: 通过形成（100）第一多层电路板以具有孔径来制造多板模块，提供（110）第二多层电路板（50）以装配在所述孔的至少一部分内，并且插入（120） 将第二多层电路板插入孔中，使得板的表面是共面的。 电路部件被安装在共面上，并且在同一步骤中，无源部件安装在穿过孔的周边的相应导体之间，以形成板之间的一个或多个电连接。 这可以避免对于电连接的单独的制造步骤的需要。 可以设置凸耳和凹槽以使插入成为压配合。 第二块板可以更薄，使其背面凹陷，从而为胶合接头提供更好的基础。