中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

5 records (took 0.007 seconds)

    METHOD FOR FORMING A COATING ON AN ELECTRONIC OR ELECTRICAL DEVICE
    1.
    发明申请
    METHOD FOR FORMING A COATING ON AN ELECTRONIC OR ELECTRICAL DEVICE 审中-公开
    在电子或电气设备上形成涂层的方法

    公开(公告)号：WO2016198855A1

    公开(公告)日：2016-12-15

    申请号：PCT/GB2016/051686

    申请日：2016-06-08

    Applicant: P2I LTD

    Inventor： COULSON, Stephen Richard ,  EVANS, Delwyn ,  HELLWIG, Thomas ,  HOPPER, Fred ,  POULTER, Neil ,  SIOKOU, Angeliki ,  TELFORD, Clive

    IPC: H05K3/28 ,  B05D1/00

    CPC classification number: H05K3/285 ,  B05D1/62 ,  B05D5/083 ,  H05K2201/09872 ,  H05K2203/095

    Abstract: An electronic or electrical device or component thereof having a coating formed thereon by exposing said electronic or electrical device or component thereof to a plasma comprising one or more monomer compounds for a sufficient period of time to allow a protective polymeric coating to form on a surface thereof;wherein the protective polymeric coating forms a physical barrier over a surface of the electronic or electrical device or component thereof; wherein each monomer is a compound of formula I(a): I(a) or a compound of formula I(b) wherein each of R 1 to R 9 is independently selected from hydrogen or halogen or an optionally substituted C 1 -C 6 branched or straight chain alkyl group; each X is independently selected from hydrogen or halogen; a is from 0-6; b is from 2 to 14; and c is 0 or 1;and wherein when each X is F or when at least one X is halogen, in particular F, the FTIR/ATR intensity ratio of CX 3 /C=O of the coating is less than (c+1)0.6e -0.1n where n is a+b+c+1;and wherein when each X is H the FTIR/ATR intensity ratio of CX 3 /C=O is less than (c+1) 0.25±0.02, optionally wherein the barrier is a conformal physical barrier.

    Abstract translation: 通过将所述电子或电气设备或其组件暴露于包含一种或多种单体化合物的等离子体足够长的时间以使其在其表面上形成保护性聚合物涂层而形成有涂层的电子或电气设备或其组件 ;其中所述保护性聚合物涂层在所述电子或电气设备或其部件的表面上形成物理屏障; 其中每个单体是式I（a）的化合物：I（a）或式I（b）的化合物，其中R 1至R 9各自独立地选自氢或卤素或任选取代的C 1 -C 6支链或直链 烷基; 每个X独立地选自氢或卤素; a是0-6; b为2〜14; 并且c为0或1;并且其中当每个X为F时或当至少一个X为卤素时，特别是F时，涂层的CX 3 / C = O的FTIR / ATR强度比小于（c + 1） 0.6e-0.1n其中n是a + b + c + 1;并且其中当每个X是H时，CX3 / C = O的FTIR / ATR强度比小于（c + 1）0.25±0.02，任选地其中 屏障是保形物理障碍。

    COATINGS
    2.
    发明申请
    COATINGS 审中-公开

    公开(公告)号：WO2016198857A9

    公开(公告)日：2016-12-15

    申请号：PCT/GB2016/051688

    申请日：2016-06-08

    Applicant: P2I LTD

    Inventor： COULSON, Stephen Richard ,  EVANS, Delwyn ,  SIOKOU, Angeliki ,  TELFORD, Clive

    IPC: C09D5/00

    Abstract: The present invention provides an electronic or electrical device or component thereof comprising a cross-linked polymeric coating on a surface of the electronic or electrical device or component thereof; wherein the cross-linked polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising a monomer compound and a crosslinking reagent for a period of time sufficient to allow formation of the cross-linked polymeric coating on a surface thereof, wherein the monomer compound has the following formula: where R 1 , R 2 and R 4 are each independently selected from hydrogen, optionally substituted branched or straight chain C 1 -C 6 alkyl or halo alkyl or aryl optionally substituted by halo, and R 3 is selected from: or where each X is independently selected from hydrogen, a halogen, optionally substituted branched or straight chain C 1 -C 6 alkyl, halo alkyl or aryl optionally substituted by halo; and n 1 is an integer from to 27; and wherein the crosslinking reagent comprises two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500°C.

    COATINGS
    3.
    发明申请
    COATINGS 审中-公开
    涂料

    公开(公告)号：WO2016198857A1

    公开(公告)日：2016-12-15

    申请号：PCT/GB2016/051688

    申请日：2016-06-08

    Applicant: P2I LTD

    Inventor： COULSON, Stephen Richard ,  EVANS, Delwyn ,  SIOKOU, Angeliki ,  TELFORD, Clive

    IPC: C09D5/00

    CPC classification number: C09D133/16 ,  B05D1/62 ,  B05D5/08 ,  B05D5/083 ,  C09D5/00 ,  H01J37/32082 ,  H01J37/32467 ,  H01J2237/332 ,  H01J2237/3382 ,  H01L21/02118 ,  H01L21/02274 ,  H01L21/56 ,  H01L23/293 ,  H01L23/564 ,  H05K3/285

    Abstract: The present invention provides an electronic or electrical device or component thereof comprising a cross-linked polymeric coating on a surface of the electronic or electrical device or component thereof; wherein the cross-linked polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising a monomer compound and a crosslinking reagent for a period of time sufficient to allow formation of the cross-linked polymeric coating on a surface thereof, wherein the monomer compound has the following formula: where R 1 , R 2 and R 4 are each independently selected from hydrogen, optionally substituted branched or straight chain C 1 -C 6 alkyl or halo alkyl or aryl optionally substituted by halo, and R 3 is selected from: or where each X is independently selected from hydrogen, a halogen, optionally substituted branched or straight chain C 1 -C 6 alkyl, halo alkyl or aryl optionally substituted by halo; and n 1 is an integer from to 27; and wherein the crosslinking reagent comprises two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500°C.

    Abstract translation: 本发明提供了一种电子或电气设备或其组件，其包括在电子或电气设备或其组件的表面上的交联聚合物涂层; 其中所述交联聚合物涂层可通过将所述电子或电气装置或其组分暴露于包含单体化合物和交联剂的等离子体的时间来获得，所述时间足以允许在其表面上形成所述交联聚合物涂层 其中所述单体化合物具有下式：其中R 1，R 2和R 4各自独立地选自氢，任选取代的支链或直链C 1 -C 6烷基或任选被卤素取代的卤代烷基或芳基，R 3选自：或 其中每个X独立地选自氢，卤素，任选取代的支链或直链C 1 -C 6烷基，任选被卤素取代的卤代烷基或芳基; n1是从27到27的整数。 并且其中所述交联试剂包含通过一个或多个接头部分连接的两个或更多个不饱和键，并且具有在小于500℃的标准压力下的沸点。

    COATING
    4.
    发明申请
    COATING 审中-公开
    涂层

    公开(公告)号：WO2016198856A1

    公开(公告)日：2016-12-15

    申请号：PCT/GB2016/051687

    申请日：2016-06-08

    Applicant: P2I LTD

    Inventor： COULSON, Stephen Richard ,  EVANS, Delwyn ,  SIOKOU, Angeliki ,  TELFORD, Clive

    IPC: C09D4/00 ,  C09D5/00

    CPC classification number: C09D5/00 ,  B05D1/62 ,  H05K3/282 ,  H05K3/285 ,  H05K2203/095

    Abstract: An electronic or electrical device or component thereof comprising a protective polymeric coating on a surface of the electronic or electrical device or component thereof, wherein the polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising one or more saturated monomer compounds for a sufficient period of time to allow the protective polymeric coating to form on a surface thereof; wherein the one or more saturated monomer compounds each have a melting point at standard pressure of less than 45°C and a boiling point at standard pressure of less than 500 °C.

    Abstract translation: 一种电子或电气设备或其组件，其包括在电子或电气设备或其组件的表面上的保护性聚合物涂层，其中所述聚合物涂层可通过将所述电子或电气设备或其组件暴露于包含一个或多个饱和 单体化合物足够的时间以允许保护性聚合物涂层在其表面上形成; 其中所述一种或多种饱和单体化合物各自具有标准压力小于45℃的熔点和小于500℃的标准压力下的沸点。

Patent Agency Ranking