公开(公告)号：WO2021211722A1

公开(公告)日：2021-10-21

申请号：PCT/US2021/027303

申请日：2021-04-14

Applicant: PPG INDUSTRIES OHIO, INC.

Inventor： MA, Liang ,  POLLUM, Marvin, M, Jr. ,  NAKAJIMA, Masayuki ,  WILLIS, Daniel, P. ,  HSU, Lorraine ,  CONDIE, Allison, G. ,  FRENCH, Maria, S. ,  ZHOU, Hongying ,  ZHENG, Qi ,  LI, Hong ,  MUNRO, Calum, H.

IPC: C08J3/20 ,  C08K3/014 ,  C08K3/08 ,  C08K3/22 ,  C08K3/36 ,  C08K3/38 ,  H01M10/653 ,  H05K1/03

Abstract: Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.