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公开(公告)号：WO2021173941A1
公开(公告)日：2021-09-02
申请号：PCT/US2021/019831
申请日：2021-02-26
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , MUNRO, Calum H. , POLLUM, JR., Marvin M. , DEI, Daniel K. , WOODWORTH, Brian E. , SCHNEIDER, John R. , FRENCH, Maria S. , CONDIE, Allison G. , GONDER-JONES, Holli , APANIUS, Christopher , BANCROFT, Cassandra Noelle
IPC: C09D5/03 , C09D163/00 , B05D1/06 , C09D171/12
Abstract: The present invention is directed towards a powder coating composition comprising a binder; a thermally conductive, electrically insulative filler material; and, optionally, a thermoplastic material and/or a core-shell polymer. The present invention is also directed to a substrate comprising a coating layer deposited from the powder coating composition of the present invention, as well as methods of coating a substrate.
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公开(公告)号：WO2020077333A1
公开(公告)日：2020-04-16
申请号：PCT/US2019/056080
申请日：2019-10-14
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , CONDIE, Allison G. , POLLUM, JR., Marvin M. , HSU, Lorraine , FRENCH, Maria S. , MUNRO, Calum H. , FANG, Shuyu , NAKAJIMA, Masayuki
Abstract: Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω•m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90 % by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10 % by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.
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3.发明申请
公开(公告)号：WO2022133202A1
公开(公告)日：2022-06-23
申请号：PCT/US2021/064015
申请日：2021-12-17
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： DEDOMENIC, Corey James , MA, Liang , POLLUM, Marvin Michael Jr. , PUODZIUKYNAITE, Egle , DACKO, Christopher Andrew , SYLVESTER, Kevin Thomas , ZAWACKY, Steven R.
Abstract: The present invention is directed towards an electrodepositable coating composition comprising an electrodepositable binder; and a thermally conductive, electrically insulative filler, a fire-retardant pigment, or a combination thereof. Also disclosed are methods of making the electrodepositable coating composition, coatings, and coated substrates.
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公开(公告)号：WO2021211722A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/027303
申请日：2021-04-14
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , POLLUM, Marvin, M, Jr. , NAKAJIMA, Masayuki , WILLIS, Daniel, P. , HSU, Lorraine , CONDIE, Allison, G. , FRENCH, Maria, S. , ZHOU, Hongying , ZHENG, Qi , LI, Hong , MUNRO, Calum, H.
Abstract: Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.
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公开(公告)号：WO2021211694A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/027252
申请日：2021-04-14
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , CONDIE, Allison G. , POLLUM, JR., Marvin M. , FRENCH, Maria S. , HSU, Lorraine , FANG, Shuyu , LI, Hong , MUNRO, Calum H. , KUTCHKO, Cynthia , EPSTEIN, Eric S. , SAHA, Gobinda
Abstract: Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50 % by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10 % by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.
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Patent Agency Ranking
公开(公告)号：WO2021211184A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/014100
申请日：2021-01-20
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , FRENCH, Maria S. , CONDIE, Allison G. , HSU, Lorraine , POLLUM, Marvin M., Jr. , LI, Hong , MUNRO, Calum H.
Abstract: Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.
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公开(公告)号：WO2021211182A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/014073
申请日：2021-01-20
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , POLLUM, JR., Marvin M. , NAKAJIMA, Masayuki , WILLIS, Daniel P. , HSU, Lorraine , CONDIE, Allison G. , FRENCH, Maria S. , ZHOU, Hongying , ZHENG, Qi , LI, Hong , MUNRO, Calum H.
Abstract: Disclosed herein is a moisture -curable composition. The composition includes a hydroly sable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/mK (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.
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公开(公告)号：WO2021174086A1
公开(公告)日：2021-09-02
申请号：PCT/US2021/020030
申请日：2021-02-26
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： WOODWORTH, Brian E. , SCHNEIDER, John R. , CHASSER, Anthony M. , MA, Liang , MUNRO, Calum H. , POLLUM, JR., Marvin M. , FRENCH, Maria S. , CONDIE, Allison G. , GONDER-JONES, Holli , DEI, Daniel K. , APANIUS, Christopher , BANCROFT, Cassandra Noelle
IPC: C09D5/00 , C09D5/02 , C09D163/00
Abstract: The present invention relates to a substrate having (a) a first material applied to at least a portion of the substrate, and (b) a coating layer deposited from a powder coating composition including a film-forming resin, and optionally a thermally conductive, electrically insulative filler material and/or a crosslinker that is reactive with the film-forming resin, in direct contact with at least a portion of the substrate to which the first material has been applied. The first material is (i) a catalyst that catalyzes cure of the powder coating composition, (ii) a component reactive with the film-forming resin and/or the crosslinker of the powder coating composition, and/or (iii) a rheology modifier.
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公开(公告)号：WO2021173991A1
公开(公告)日：2021-09-02
申请号：PCT/US2021/019895
申请日：2021-02-26
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： VISSER, Sijmen J. , WOODWORTH, Brian E. , GONDER-JONES, Holli , SCHNEIDER, John R. , MOORE, Kelly L. , FOLLET, Mark L. , MA, Liang , MUNRO, Calum H. , POLLUM, JR., Marvin M. , FRENCH, Maria S. , CONDIE, Allison G. , HARRISON, Amy E. , SCHWENDEMAN, Irina G. , DEI, Daniel K. , BANCROFT, Cassandra Noelle , APANIUS, Christopher , SYLVESTER, Kevin T. , DEDOMENIC, Corey J. , PUODZIUKYNAITE, Egle
IPC: C09D5/03 , C09D163/00 , C09D175/00 , C09D133/00 , B05D1/06 , C09D5/44 , B05D7/00
Abstract: The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.
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公开(公告)号：WO2021011628A1
公开(公告)日：2021-01-21
申请号：PCT/US2020/042099
申请日：2020-07-15
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MEZZANOTTI, Fabien , LÉON, Josiane , MA, Liang , CONDIE, Allison G. , FRENCH, Maria S.
IPC: C08K3/22 , H01M10/613 , H05K1/02 , H01M10/625 , H01M10/653
Abstract: The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω m (measured according to ASTM D257, C611, or B 193) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.
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