公开(公告)号：WO2020234583A1

公开(公告)日：2020-11-26

申请号：PCT/GB2020/051222

申请日：2020-05-19

Applicant: PRAGMATIC PRINTING LTD.

Inventor： WILLIAMSON, Ken ,  PRICE, Richard

IPC: H01L23/00 ,  H01L23/64

Abstract: A method for fabricating a thin-film integrated circuit, IC, including a plurality of electronic components, the method comprising: forming, using a first fabrication technique, the plurality of electronic components, and forming, using a second fabrication technique, a conductive layer on the plurality of electronic components to form a redistribution layer, RDL, wherein the first fabrication technique includes photolithographic patterning, and the first fabrication technique is different to the second fabrication technique.

公开(公告)号：WO2020161027A1

公开(公告)日：2020-08-13

申请号：PCT/EP2020/052511

申请日：2020-01-31

Applicant: PRAGMATIC PRINTING LTD.

Inventor： COBB, Brian ,  WHITE, Scott ,  WILLIAMSON, Ken ,  SOU, Anthony ,  RAMSDALE, Catherine ,  MANN, Rob ,  DAVIES, Neil ,  OLIVEIRA, Joao de ,  EWERS, Gillian ,  BOULANGER, Pascaline ,  PRICE, Richard

IPC: H01L23/538 ,  H01L23/498

Abstract: The present invention provides for an interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly comprises a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within said flexible base layer, and at least one first patterned contact layer, provided on any one of said first surface and said second surface of said flexible base layer and which is configured to operably interface with said at least one active electronic circuit component and the at least one 1C component.