公开(公告)号：WO2013148102A1

公开(公告)日：2013-10-03

申请号：PCT/US2013/029557

申请日：2013-03-07

Applicant: RAYTHEON COMPANY

Inventor： DANELLO, Paul, A. ,  STANDER, Richard, A. ,  GOULET, Michael, D.

IPC: H01L23/433 ,  H01L25/065

CPC classification number: H01L23/433 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.

Abstract translation: 提供一种形成用于半导体电路的散热结构的方法。 提供了第一和第二半导体集成电路（IC）芯片，其中第一和第二半导体芯片各自具有第一和第二相对侧，其中第一和第二半导体IC芯片被配置为固定地附接到基本上平面的顶表面 电路板沿其各自的第一侧。 第一和第二半导体IC芯片中的每一个的相应的第二相对侧耦合到牺牲散热器材料的第一和第二相应部分，所述牺牲散热器材料包括导热材料。 牺牲散热器材料的第一部分和第二部分被平坦化，以使第一半导体芯片的相应的第一高度和第二半导体芯片的相应的第二高度基本相等。

公开(公告)号：WO2003067942A2

公开(公告)日：2003-08-14

申请号：PCT/US2003/003714

申请日：2003-02-06

Applicant: RAYTHEON COMPANY

Inventor： DANELLO, Paul, A. ,  MIRABILE, Joseph, A. ,  CARRARA, Anthony

IPC: H05K

CPC classification number: H01R4/5016 ,  H01R12/7005 ,  H01R12/82 ,  H05K7/1404

Abstract: A symmetric wedgelock system includes a compression device having a longitudinal axis; a plurality of segments arranged along the compression device including at least one drive segment at each end and at least one working segment in between each working segment including at least two sections having diverging sides forming a concave wedge facing an associated drive segment; each drive segment having converging sides forming a convex wedge facing an associated working segment; the compression device includes an adjustment device for applying a compressive force along the longitudinal axis to drive the convex wedges of the drive segment into the concave wedges of the working segment to drive apart laterally the sections of the working segment.

Abstract translation: 对称楔块系统包括压缩装置，该压缩装置具有沿着压缩装置布置的多个段的纵向轴线，所述多个段包括在每个端部处的至少一个驱动段和在每个工作段之间的至少一个工作段，所述至少一个工作段包括至少两个具有形成 面对相关联的驱动段的凹形楔形件，每个驱动段具有会聚侧面，形成面向相关联的工作段的凸形楔形物，压缩装置包括用于沿着纵向轴线施加压缩力的调节装置，以将驱动段的凸形楔块驱动到 工作段的凹形楔子横向驱动工作段的各部分。

公开(公告)号：WO2003067942A3

公开(公告)日：2003-08-14

申请号：PCT/US2003/003714

申请日：2003-02-06

Applicant: RAYTHEON COMPANY

Inventor： DANELLO, Paul, A. ,  MIRABILE, Joseph, A. ,  CARRARA, Anthony

IPC: A47F7/00

Abstract: A symmetric wedgelock system (18) includes a compression device (30) having a longitudinal axis; a plurality of segments arranged along the compression device including at least one drive segment at each end (38), (40) and at least one working segment in between each working segment including at least two sections having diverging sides forming a concave wedge facing an associated drive segment; each drive segment having converging sides forming a convex wedge (74) facing an associated working segment; the compression device includes an adjustment device for applying a compressive force along the longitudinal axis to drive the convex wedges (84), (86) of the drive segment into the concave wedges (108), (110) of the working segment to drive apart laterally the sections of the working segment.

公开(公告)号：WO2011046707A1

公开(公告)日：2011-04-21

申请号：PCT/US2010/049261

申请日：2010-09-17

Applicant: RAYTHEON COMPANY ,  DANELLO, Paul, A. ,  CHEYNE, Scott, R. ,  ELLSWORTH, Joseph, R. ,  TELLINGHUISEN, Thomas, J.

Inventor： DANELLO, Paul, A. ,  CHEYNE, Scott, R. ,  ELLSWORTH, Joseph, R. ,  TELLINGHUISEN, Thomas, J.

IPC: H05K7/20 ,  H01Q21/00

CPC classification number: H05K7/20509 ,  H01Q21/0087

Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Abstract translation: 在一个方面，组件包括包括第一表面的面板。 面板还包括耦合到面板的第一表面的第一有源电路和具有第一孔的冷板。 冷板包括由第一孔露出的第一内表面。 面板还包括与冷板的第一内表面和第一有源电路接触的第一导热材料。