公开(公告)号：WO2021014002A1

公开(公告)日：2021-01-28

申请号：PCT/EP2020/071001

申请日：2020-07-24

Applicant: ABB POWER GRIDS SWITZERLAND AG

Inventor： TORRESIN, Daniele ,  MOHN, Fabian ,  AGOSTINI, Bruno ,  GRADINGER, Thomas ,  SCHUDERER, Juergen

IPC: B23K37/00 ,  H01L23/10 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H01L21/56 ,  H01L23/373 ,  H01L23/433

Abstract: The invention relates to method of providing a power semiconductor module (10) with a cooler (12), wherein a cooling structure (32) is welded to a flat surface of a substrate (14) or a baseplate (15). The present invention further relates to an arrangement of a power semiconductor module (10) being formed according to such a method.

公开(公告)号：WO2020112912A1

公开(公告)日：2020-06-04

申请号：PCT/US2019/063460

申请日：2019-11-26

Applicant: QORVO US, INC.

Inventor： COSTA, Julio, C. ,  MAXIM, George

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/367 ,  H01L25/065

Abstract: A thermally enhanced package includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor. The thinned die includes a device layer over the carrier and a dielectric layer over the device layer. The mold compound resides over the carrier, surrounds the thinned die, and extends beyond a top surface of the thinned die to define an opening within the mold compound and over the thinned die. The top surface of the thinned die is at a bottom of the opening. At least a portion of the heat extractor is inserted into the opening and in thermal contact with the thinned die. Herein the heat extractor is formed of a metal or an alloy.

公开(公告)号：WO2020099738A1

公开(公告)日：2020-05-22

申请号：PCT/FR2019/052094

申请日：2019-09-10

Applicant: VALEO SYSTEMES THERMIQUES

Inventor： AZZOUZ, Kamel ,  GARNIER, Sébastien ,  MAMMERI, Amrid

IPC: H01M10/613 ,  F28F3/00 ,  H01L23/433 ,  H01M10/6556 ,  H01M10/6569 ,  H05K7/20 ,  H01M10/625

Abstract: L'invention concerne un dispositif de régulation thermique (2), notamment de refroidissement, pour un composant électrique (103), notamment une batterie, dont la température doit être régulée, ledit composant électrique (103) étant notamment susceptible de dégager de la chaleur lors de son fonctionnement, le dispositif de régulation thermique comportant au moins un premier circuit (4) configuré pour permettre la circulation d'un fluide caloporteur; au moins un deuxième circuit (5) configuré pour transporter un fluide diélectrique, ce deuxième circuit comportant au moins une sortie de distribution du fluide diélectrique en direction du composant électrique; au moins un premier circuit (4) et au moins un deuxième circuit (5) étant agencés de sorte que le premier circuit est en interaction thermique avec le fluide distribué par l'au moins une sortie du deuxième circuit.

公开(公告)号：WO2019048864A1

公开(公告)日：2019-03-14

申请号：PCT/GB2018/052526

申请日：2018-09-06

Applicant: ICEOTOPE LIMITED ,  ICEOTOPE GROUP LIMITED

Inventor： AMOS, David ,  EDMUNDS, Neil ,  YOUNG, Andrew ,  KIDGER, Jasper ,  LONGHURST, Nathan

IPC: H01L23/433 ,  H05K7/20

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heatis transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. Anozzle arrangementmay direct liquid coolant to abase of the heat sink.

公开(公告)号：WO2019037867A1

公开(公告)日：2019-02-28

申请号：PCT/EP2017/071429

申请日：2017-08-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD. ,  DURAN, Hamit

Inventor： DURAN, Hamit ,  JUNFU, Hu

IPC: H01L23/36 ,  H01L23/498 ,  H01L23/433 ,  H01L23/495 ,  H01L23/538

Abstract: The present invention relates to a semiconductor module, especially a power semiconductor module, in which the heat dissipation is improved and the power density is increased. The semiconductor module (100) comprises at least two electrically insulating substrates (101a, 101b), each having a first main surface (102a, 102b) and a second main surface (103a, 103b) opposite to the first main surface. On the first main surface of each of the substrates, at least one semiconductor device (110) is mounted. An external terminal (120) is connected to the first main surface of at least one of the substrates. The substrates are arranged opposite to each other so that their first main surfaces are facing each other.

公开(公告)号：WO2018125251A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069641

申请日：2016-12-31

Applicant: INTEL CORPORATION

Inventor： MALLIK, Debendra ,  RAORANE, Digvijay A.

IPC: H01L23/16 ,  H01L23/433 ,  H01L25/065

Abstract: An electronic package technology is disclosed. A first active die can be mountable to and electrically coupleable to a package substrate. A second active die can be disposed on a top side of the first active die, the second active die being electrically coupleable to one or both of the first active die and the package substrate. At least one open space can be available on the top side of the first active die. At least a portion of a stiffener can substantially fill the at least one open space available on the top side of the first active die.

公开(公告)号：WO2018080594A1

公开(公告)日：2018-05-03

申请号：PCT/US2017/030714

申请日：2017-05-03

Applicant: RAYTHEON COMPANY

Inventor： WONG, Tse, E. ,  TONOMURA, Samuel, D. ,  SOX, Stephen, E.

IPC: H01L23/433 ,  H01L25/065

Abstract: A hybrid micro-circuit device has multiple layers overlying a printed circuit board (PCB), including a first semiconductor chip component that is electrically connected to the PCB, and a second semiconductor chip component that is electrically connected to first semiconductor chip component. A molding compound surrounds the stack of components that includes the semiconductor chip components. This molding compound may include pillars that are higher than the height of the stacked components. The pillars of molded material may be configured to receive most of the stress from other components over the stacked components. The pillars of molded material may also help define a recess between the stack components and the other components that overlie the stacked components, where a thermal interface material (TIM) may be located. Further, there may be an air gap between parts of the semiconductor chip components.

Abstract translation: 混合微电路装置具有覆盖印刷电路板（PCB）的多个层，包括电连接到PCB的第一半导体芯片部件和电连接到第二半导体芯片部件的第二半导体芯片部件 到第一半导体芯片组件。 模制化合物围绕包括半导体芯片组件的组件堆叠。 该模塑料可以包括比堆叠部件的高度更高的支柱。 模制材料的支柱可以被配置为接收来自堆叠部件上的其他部件的大部分应力。 模制材料的支柱还可以帮助在堆叠组件和堆叠组件之上的其他组件之间限定凹槽，其中可以放置热界面材料（TIM）。 此外，半导体芯片组件之间可能存在气隙。

公开(公告)号：WO2017032477A1

公开(公告)日：2017-03-02

申请号：PCT/EP2016/064257

申请日：2016-06-21

Applicant: ROBERT BOSCH GMBH

Inventor： TAUFER, Peter ,  BUTZMANN, Stefan ,  ECKERT, Bernd

IPC: H01L23/433 ,  H01L23/40

CPC classification number: H01L23/36 ,  H01L23/4338 ,  H01L2023/4031 ,  H01L2023/4081 ,  H01L2224/72

Abstract: Vorrichtung (100) zur Kühlung einer Vielzahl von elektrischen Bauelementen (BE1, BE2.. BEn), wobei die elektrischen Bauelemente (BE1, BE2.. BEn) jeweils eine zu kühlende Bauelementkühlfläche (BEK1, BEK2.. BEKn) aufweisen, wobei die Vorrichtung (100) einen ersten Kühlkörper (K1) mit einer ersten Kühlkörperkühlfläche (KF1) und einen zweiten Kühlkörper (K2) mit einer zweiten Kühlkörperkühlfläche (KF2) aufweist, wobei die Kühlkörperkühlflächen (KF1, KF2) gegenüberliegend flächig angeordnet sind, dadurch gekennzeichnet, dass die erste Kühlkörperkühlfläche (KF1) zur Anbringung einer ersten Teilmenge der Bauelementkühlflächen (BEK1, BEK2.. BEKn) der Vielzahl von elektrischen Bauelementen (BE1, BE2.. BEn) ausgestaltet ist und die zweite Kühlkörperkühlfläche (KF2) zur Anbringung einer zweiten Teilmenge der Bauelementkühlflächen (BEK1, BEK2.. BEKn) der Vielzahl von elektrischen Bauelementen (BE1, BE2.. BEn) ausgestaltet ist und Befestigungsmittel (BM1, BM2.. BMn) vorgesehen sind zur Befestigung der anzubringenden Bauelementkühlflächen (BEK1, BEK2.. BEKn) der Vielzahl von elektrischen Bauelementen (BE1, BE2.. BEn) an die Kühlkörperkühlflächen (KF1, KF2).

Abstract translation: 用于冷却多个电子装置（BE1，BE2 .. BEN），其中所述电元件（BE1，BE2 .. BEN）在每种情况下一个组件来冷却的冷却表面（BEK1，BEK2 .. BEKN）的，其中，所述设备的装置（100） （100）的第一冷却体（K1）与第一散热片散热表面（KF 1）和第二散热器（K2）与第二散热片散热面积（KF2），其中所述散热器冷却表面（KF1，KF2）布置相反的表面，其特征在于 第一散热器冷却面积（KF1）用于安装构件冷却多个电气安装件（BE1，BE2 .. BEN）的表面（BEK1，BEK2 .. BEKN）的第一子集被配置成与第二散热片散热面积（KF2）用于安装所述部件的冷却表面的第二子集（ BEK1，BEK2 BEKN ..）的所述多个电气元件（BE1，BE2 .. BEN）被配置和固定装置（BM1，BM2 .. BMN ）被提供用于安装的构件冷却表面的紧固（BEK1，BEK2 BEKN ..）的所述多个电气元件的（BE1，BE2 .. BEN）（至散热器冷却表面KF1，KF2）。

公开(公告)号：WO2016200534A1

公开(公告)日：2016-12-15

申请号：PCT/US2016/031761

申请日：2016-05-11

Applicant: VISHAY GENERAL SEMICONDUCTOR LLC

Inventor： DING, Hui-Ying ,  WANG, Pengnian ,  YU, Tao ,  LIU, Jun-Feng ,  BAI, Jun-Kai ,  PENG, Chih-Ping

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/31 ,  H01L23/64 ,  H01L33/48

CPC classification number: H01L23/49575 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49517 ,  H01L2021/6027 ,  H01L2021/60277 ,  H01L2224/33 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.

Abstract translation: 半导体组件包括包括下电极和上电触头的半导体管芯。 具有下管芯焊盘的引线框架电连接和机械连接到管芯的下电触头。 上导电构件具有电和机械地连接到管芯的上电接触件的第一部分。 引线端子具有电气和机械连接到导电构件的第二部分的表面部分。 引线端子的表面部分和/或导电部件的第二部分具有设置在其中的一系列凹槽。 包装材料封装半导体管芯，引线框架的至少一部分，上部导电构件的至少一部分和引线端子的至少一部分。

公开(公告)号：WO2016128231A1

公开(公告)日：2016-08-18

申请号：PCT/EP2016/051875

申请日：2016-01-29

Applicant: DANFOSS SILICON POWER GMBH

Inventor： EISELE, Ronald ,  OSTERWALD, Frank

IPC: H01L23/433 ,  H01L23/29 ,  H01L23/495

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L23/291 ,  H01L23/3121 ,  H01L23/4334 ,  H01L2224/32245 ,  H01L2224/83801 ,  H01L2224/8384

Abstract: A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate (40).

Abstract translation: 具有引线框架（20）的功率模块（10），布置在引线框架（20）上的功率半导体（30）），用于分散由功率半导体（30）产生的热量的基板（40）和灌封化合物 ）包围引线框架（20）和功率半导体（30），其将功率半导体（30）和/或引线框（20）物理连接到基板（40）。