UWB AND IR/OPTICAL FEED CIRCUIT AND RELATED TECHNIQUES
    1.
    发明申请
    UWB AND IR/OPTICAL FEED CIRCUIT AND RELATED TECHNIQUES 审中-公开
    UWB和IR /光学馈电及相关技术

    公开(公告)号:WO2017034630A1

    公开(公告)日:2017-03-02

    申请号:PCT/US2016/030506

    申请日:2016-05-03

    CPC classification number: H01P3/087 G02B6/00 G02B6/028 H01P3/084 H01P3/088

    Abstract: An ultra wideband (UWB) feed circuit is provided from an optical substrate disposed over a multi-layer dielectric substrate with each layer being provided from a material having a relatively low relative dielectric constant. Conductor layers are disposed between at least a pair of the dielectric substrates which make up the multi-layer dielectric substrate. The multi-layer dielectric substrate is, in turn, disposed over a suspended air stripline (SAS) signal path comprised of a substrate having a conductor disposed thereover. The optical substrate, multi-layer dielectric substrate and SAS are disposed in a radio frequency (RF) waveguide.

    Abstract translation: 从设置在多层电介质基板上的光学基板提供超宽带(UWB)馈电电路,每层由具有相对低的相对介电常数的材料提供。 导体层设置在构成多层电介质基板的至少一对电介质基板之间。 多层电介质衬底又设置在由其上设置有导体的衬底组成的悬浮空气带状线(SAS)信号路径上。 光学基板,多层电介质基板和SAS设置在射频(RF)波导中。

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