公开(公告)号：WO2013029375A1

公开(公告)日：2013-03-07

申请号：PCT/CN2012/073807

申请日：2012-04-11

Applicant: 深圳光启高等理工研究院 ,  深圳光启创新技术有限公司 ,  刘若鹏 ,  季春霖 ,  岳玉涛 ,  李星昆 ,  周添 ,  宿超 ,  杨树坤

Inventor： 刘若鹏 ,  季春霖 ,  岳玉涛 ,  李星昆 ,  周添 ,  宿超 ,  杨树坤

IPC: H01P3/08

CPC classification number: H01P3/08 ,  H01P3/084

Abstract: 本发明涉及一种微带线，该微带线包括金属带、介质基板以及接地板，其特征在于，所述介质基板由第一基板和第二基板拼接而成，所述第一基板和第二基板具有不同的折射率分布，第一基板两侧均拼接有第二基板，其中，所述金属带正下方设置有第一基板，所述接地板位于所述介质基板的正下方。本发明微带线通过在金属带下面采用两种具有不同的折射率分布的介质基板，有效地抑制空间波泄露，解决微带线之间电磁波串扰的问题。

公开(公告)号：WO2007021307A3

公开(公告)日：2007-08-16

申请号：PCT/US2006004802

申请日：2006-02-09

Applicant: NAVINI NETWORKS INC ,  GRABNER JOHN ,  SMITH RICHARD ,  CONDON ED

Inventor： GRABNER JOHN ,  SMITH RICHARD ,  CONDON ED

IPC: H01Q1/38

CPC classification number: H01Q9/0407 ,  H01P3/084 ,  H01Q1/38

Abstract: A method and system is disclosed for a microstrip antenna module having an antenna structure with one or more radiating elements and an integral feed structure enclosing at least one transmission line, wherein the antenna structure and the feed structure share a ground plane.

Abstract translation: 公开了一种用于具有具有一个或多个辐射元件的天线结构和封闭至少一个传输线的整体馈送结构的微带天线模块的方法和系统，其中天线结构和馈电结构共享接地平面。

公开(公告)号：WO00062368A1

公开(公告)日：2000-10-19

申请号：PCT/FI2000/000274

申请日：2000-03-30

IPC: H01B11/00 ,  H01P3/08 ,  H05K1/02

CPC classification number: H01P3/084 ,  H05K1/024

Abstract: The invention relates to a transmission cable realised by multilayer technique, where the signal cable (20) is set at a desired distance from the wall of the cavity constructed for said transmission cable by means of a separate support element (25). The ground cable (21) included in the structure is placed on the cable cavity wall opposite to the signal cable. By using the transmission cable according to the invention, there is achieved a low attenuation per unit of length at RF frequencies.

Abstract translation: 本发明涉及通过多层技术实现的传输电缆，其中信号电缆（20）通过单独的支撑元件（25）设置在为所述传输电缆构造的空腔的壁所需的距离处。 包括在结构中的接地电缆（21）被放置在与信号电缆相对的电缆腔壁上。 通过使用根据本发明的传输电缆，在RF频率处实现了每单位长度的低衰减。

公开(公告)号：WO2018080587A1

公开(公告)日：2018-05-03

申请号：PCT/US2017/027518

申请日：2017-04-14

Applicant: RAYTHEON COMPANY

Inventor： WARGO, Matthew, J. ,  ANDERSON, Joseph, M. ,  STEWART, Kelly, Ryian ,  SALEM, Matthew

IPC: H01P5/02 ,  H01P3/08 ,  H01P1/04

CPC classification number: H01P5/028 ,  H01P1/042 ,  H01P1/047 ,  H01P3/084 ,  H01P3/087 ,  H01P3/12 ,  H01P3/13 ,  H05K9/00

Abstract: The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.

Abstract translation: 这里描述的概念，系统和方法针对天线和RF处理器之间的无连接器射频（RF）接口。 提供RF互连，其具有其中提供脊形波导部分的外壳，形成在外壳上部的上腔，形成在外壳下部的下腔，第一悬置空气带状线（SAS）传输线 设置在所述下腔中，使得所述第一SAS传输线的至少一部分与由所述脊形波导和设置在所述上​​腔中的第二SAS传输线形成的槽交叉，使得所述第二SAS传输线的至少一部分穿过 由脊形波导形成的槽。

公开(公告)号：WO2014059216A1

公开(公告)日：2014-04-17

申请号：PCT/US2013/064443

申请日：2013-10-11

Applicant: HARRIS CORPORATION

Inventor： ROGERS, John E. ,  JACKSON, Ronald E.

IPC: H01Q9/16 ,  H01Q9/42 ,  H01P3/08 ,  H01Q21/00

CPC classification number: H01P3/084 ,  H01P3/06 ,  H01Q9/16 ,  H01Q9/42 ,  H01Q21/0081

Abstract: Method for constructing an antenna includes depositing on a substrate (202) at least one layer each of a conductive material (604, 606, 610, 612, 614, 616, 618), a dielectric material (609), and a sacrificial material. The deposit of conductive material is controlled to form a transmission line (204), antenna radiating element (210a, 210b) and associated antenna feed. The transmission line includes a shield (206) and a center conductor (208) disposed coaxially within the shield. An antenna feed portion (212) is electrically connected to the center conductor extends through a feed port on the transmission line to connect with an antenna radiating element (210a. 210b). The radiating element extends a first predetermined length transverse to an axis of the transmission line.

Abstract translation: 用于构造天线的方法包括在导电材料（604,606,610,612,614,618），介电材料（609）和牺牲材料中至少一层的基底（202）上沉积。 控制导电材料的沉积以形成传输线（204），天线辐射元件（210a，210b）和相关天线馈电。 传输线包括同屏在屏蔽内设置的屏蔽（206）和中心导体（208）。 天线馈电部分（212）电连接到中心导体，延伸穿过传输线上的馈送端口，以与天线辐射元件（210a，210b）连接。 辐射元件横向于传输线的轴线延伸第一预定长度。

公开(公告)号：WO2007036607A1

公开(公告)日：2007-04-05

申请号：PCT/FI2006/050411

申请日：2006-09-26

Applicant: FILTRONIC COMTEK OY ,  STOYANOV, Vladimir ,  NÄRHI, Harri

Inventor： STOYANOV, Vladimir ,  NÄRHI, Harri

IPC: H01P3/18 ,  H01P3/08

CPC classification number: H01P3/081 ,  H01P3/084 ,  H01P3/087

Abstract: A transmission line structure suited as a transmission path for antenna feed in base stations. The circuit board technique is applied to the manufacture of a transmission line structure (400) for implementing an air-insulation between the centre and ground conductor of the transmission line. The circuit board is a multi- layer board, and a microstrip (440) functions as the line centre conductor. Material has been removed from adjacent layers (432, 433) at the centre conductor and its sides, and a cavity thus formed functions as an air-insulation between the centre conductor (440) and ground conductor (410) of the transmission line. The ground conductor is a part of the metal body of the device containing the transmission line. The structure can comprise several transmission lines, each of which has a cavity of its own in the same multi-layer board. The structure can also be two- sided so that there are similar cavities and a ground conductor on each side of the layer, which comprises the centre conductor(s). The losses of a transmission line are relatively low, and its production costs also are relatively low. Other functional parts, such as directional coupler and power divider, can be integrated to the structure without adding the stage number of the manufacture.

Abstract translation: 适用于基站天线馈电传输路径的传输线路结构。 电路板技术应用于制造传输线结构（400），用于实现传输线路的中心和接地导体之间的空气绝缘。 电路板是多层板，微带线（440）用作线路中心导体。 已经在中心导体及其侧面处从相邻层（432,433）移除了材料，并且由此形成的空腔用作传输线路的中心导体（440）和接地导体（410）之间的空气绝缘。 接地导体是包含传输线的设备的金属体的一部分。 该结构可以包括多个传输线，每条传输线在相同的多层板中都具有自己的空腔。 该结构也可以是双面的，使得在层的每一侧上都有类似的空腔和接地导体，其包括中心导体。 传输线的损耗相对较低，生产成本也相对较低。 其他功能部件，如定向耦合器和功率分配器，可以集成到结构中，而不需要增加制造阶段的数量。

公开(公告)号：WO2017039851A1

公开(公告)日：2017-03-09

申请号：PCT/US2016/042706

申请日：2016-07-18

Applicant: GENERAL ELECTRIC COMPANY

Inventor： LEE, Yongjae ,  IANNOTTI, Joseph, Alfred ,  KEIMEL, Christopher, Fred ,  KAPUSTA, Christopher, James

IPC: H01P3/08 ,  H01P1/12

CPC classification number: H01P1/15 ,  H01H55/00 ,  H01H57/00 ,  H01H59/0009 ,  H01H61/01 ,  H01H2057/006 ,  H01H2061/006 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/54 ,  H01L21/56 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01P1/127 ,  H01P3/084

Abstract: A RF MEMS package includes a MEMS die assembly having a signal line (46) formed on a top surface of a first mounting substrate (42), the signal line comprising a MEMS device (48) selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads (52, 54, 56, 58) formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly (43) is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region (62) formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

Abstract translation: RF MEMS封装包括具有形成在第一安装衬底（42）的顶表面上的信号线（46）的MEMS管芯组件，所述信号线包括MEMS器件（48），所述MEMS器件选择性地电耦合信号线的第一部分 到信号线的第二部分，以及形成在第一安装基板的顶表面上的两对接地焊盘（52,54,56,58），其与信号线的相应部分相邻。 接地焊盘对被定位在MEMS器件的相应侧面附近。 接地组件（43）电耦合到所述一对接地焊盘，并且包括形成在所述第二安装衬底的表面上的第二安装衬底和接地区域（62）。 接地区域面向第一安装基板的顶表面并且电耦合到成对的接地焊盘。 在接地区域和信号线之间形成空穴。

公开(公告)号：WO2008036029A1

公开(公告)日：2008-03-27

申请号：PCT/SE2007/000834

申请日：2007-09-24

Applicant: POWERWAVE TECHNOLOGIES SWEDEN AB ,  LINDMARK, Björn

Inventor： LINDMARK, Björn

IPC: H01P11/00 ,  H01P3/08 ,  H05K1/02

CPC classification number: H01P3/02 ,  H01P3/084 ,  H01P11/001 ,  H05K1/024 ,  H05K3/107 ,  H05K3/202 ,  H05K2201/09236 ,  Y10T29/49016

Abstract: Method of manufacturing a transmission line including the steps : - forming an element with at least one longitudinal groove on a surface of said element, said longitudinal groove being defined by two opposite wall portions in the element and having a longitudinal opening adjacent to said surface, and - locating a conductor line in said at least one longitudinal groove. The method is distinguished by the steps: - forming the conductor line from a metal strip upon punching the same from a sheet of metal, - attaching the metal strip to at least one holding device, and - mounting said at least one holding device, with the attached metal strip, on said element, so as to locate said metal strip in said longitudinal groove at a distance from said opposite wall portions of said element. The invention also concerns a transmission line manufactured in accordance with said method.

Abstract translation: 一种传输线的制造方法，包括以下步骤： - 在所述元件的表面上形成具有至少一个纵向凹槽的元件，所述纵向凹槽由所述元件中的两个相对的壁部分限定，并具有与所述表面相邻的纵向开口， 以及 - 将导线定位在所述至少一个纵向凹槽中。 该方法的特征在于以下步骤： - 从金属板冲压金属带时形成导体线， - 将金属带连接到至少一个保持装置，以及 - 将所述至少一个保持装置安装到 所述金属带在所述元件上，以便将所述金属带定位在所述纵向槽中与所述元件的所述相对壁部分相距一定距离处。 本发明还涉及根据所述方法制造的传输线。

公开(公告)号：WO9927606A3

公开(公告)日：1999-08-19

申请号：PCT/SE9802092

申请日：1998-11-19

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  GEORGIAN SPARTAK

IPC: H01P3/08 ,  H01Q9/04 ,  H01Q13/20 ,  H01Q21/00 ,  H05K1/02

CPC classification number: H01P3/084 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q13/206 ,  H01Q21/0081 ,  H05K1/024 ,  H05K1/0245 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/098 ,  H05K2201/09972

Abstract: The invention relates to a microstrip arrangement comprising a first and a second microstrip conductor. The two microstrip conductors have essentially the same dimensions in their longitudinal direction and transverse direction, and are galvanically interconnected by means of at least one connection. The two microstrip conductors also extend essentially parallel to one another on either side of a dielectric material. As a result of this design of the microstrip arrangement, the field losses and also other influences caused by the dielectric material will be very considerably reduced, and in practice a resultant microstrip arrangement is obtained, which, with regard to its electrical performance, appears to be suspended in the air. Preferred embodiments comprise a microstrip antenna, a circuit board and a conductor application.

Abstract translation: 本发明涉及包括第一和第二微带导体的微带装置。 两个微带导体在其纵向方向和横向方向上具有基本相同的尺寸，并且通过至少一个连接电流互连。 两个微带导体也在电介质材料的任一侧基本上彼此平行地延伸。 由于微带装置的这种设计，由介电材料引起的场损耗和其它影响将非常显着地降低，并且实际上获得了所得到的微带结构，就其电性能而言，似乎 悬浮在空中。 优选实施例包括微带天线，电路板和导体应用。

公开(公告)号：WO2017034630A1

公开(公告)日：2017-03-02

申请号：PCT/US2016/030506

申请日：2016-05-03

Applicant: RAYTHEON COMPANY

Inventor： STRATIS, Glafkos, K. ,  MILLS, Douglas ,  HOPKINS, Kevin, R. ,  GRAFFAM, Raymond, A. ,  KNAPP, David, J. ,  SMITH, Michael, S.

IPC: H01P3/08 ,  G02B6/00

CPC classification number: H01P3/087 ,  G02B6/00 ,  G02B6/028 ,  H01P3/084 ,  H01P3/088

Abstract: An ultra wideband (UWB) feed circuit is provided from an optical substrate disposed over a multi-layer dielectric substrate with each layer being provided from a material having a relatively low relative dielectric constant. Conductor layers are disposed between at least a pair of the dielectric substrates which make up the multi-layer dielectric substrate. The multi-layer dielectric substrate is, in turn, disposed over a suspended air stripline (SAS) signal path comprised of a substrate having a conductor disposed thereover. The optical substrate, multi-layer dielectric substrate and SAS are disposed in a radio frequency (RF) waveguide.

Abstract translation: 从设置在多层电介质基板上的光学基板提供超宽带（UWB）馈电电路，每层由具有相对低的相对介电常数的材料提供。 导体层设置在构成多层电介质基板的至少一对电介质基板之间。 多层电介质衬底又设置在由其上设置有导体的衬底组成的悬浮空气带状线（SAS）信号路径上。 光学基板，多层电介质基板和SAS设置在射频（RF）波导中。