公开(公告)号：WO2002081584A1

公开(公告)日：2002-10-17

申请号：PCT/US2002/009805

申请日：2002-03-27

Applicant: RODEL HOLDINGS, INC.

Inventor： COSTAS, Wesley, D. ,  LACK, Craig, D. ,  SAUCY, Daniel, A.

IPC: C09G1/02

CPC classification number: C23F3/00 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/3212

Abstract: An aqueous polishing composition for chemical mechanical polishing to remove copper from a buffer material, the composition comprising, an oxidizing agent, a complexing agent, an inhibitor, a dishing reducing agent, and abrasive particles comprising organic polymer particles for clearing relatively soft copper from the buffer material by chemical mechanical polishing while minimizing dishing and avoiding removal of the buffer material.

Abstract translation: 一种用于化学机械抛光以从缓冲材料中除去铜的水性抛光组合物，所述组合物包含氧化剂，络合剂，抑制剂，凹陷还原剂和包含有机聚合物颗粒的磨料颗粒，用于从 通过化学机械抛光缓冲材料，同时最小化凹陷并避免缓冲材料的去除。