公开(公告)号：WO2014042327A1

公开(公告)日：2014-03-20

申请号：PCT/KR2013/002742

申请日：2013-04-03

Applicant: SAMSUNG TECHWIN CO., LTD

Inventor： KIMIYUKI, Yamasaki

IPC: H05K13/02 ,  B65D73/02 ,  B65D85/86

CPC classification number: H05K13/02 ,  B65D73/02 ,  B65D85/671 ,  B65H35/0006 ,  B65H37/002 ,  H05K13/021 ,  H05K13/0408 ,  H05K13/0417 ,  Y10T156/1168 ,  Y10T156/1967

Abstract: A tape feeder for a chip mounter, the tape feeder including: a tape support unit extending along a moving direction of a carrier tape to which a cover tape is separably attached, and contacting a top surface of the carrier tape; a separation unit separating a first side portion of the cover tape in a lengthwise direction; a bending guide unit guiding the first side portion of the cover tape separated from the carrier tape such that the first side portion of the cover tape separated from the carrier tape is bent and away from the separated portion of the carrier tape; and a folding guide unit folding the first side portion over a second side portion of the cover tape to drop the first side portion downward.

Abstract translation: 一种用于芯片安装器的带式馈送器，该带式馈送器包括：带状支撑单元，其沿着载带的移动方向延伸，盖带可分离地附接到载带上，并与载带的顶表面接触; 分离单元，其沿长度方向分隔所述盖带的第一侧部; 弯折引导单元引导与载带分离的盖带的第一侧部，使得与载带分离的盖带的第一侧部弯曲并远离载带的分离部分; 以及折叠引导单元，其将所述第一侧部折叠在所述盖带的第二侧部上，以使所述第一侧部向下方落下。

公开(公告)号：WO2014025115A1

公开(公告)日：2014-02-13

申请号：PCT/KR2013/002744

申请日：2013-04-03

Applicant: SAMSUNG TECHWIN CO., LTD

Inventor： KIMIYUKI, Yamasaki

IPC: H05K13/02 ,  H05K13/04 ,  B65D73/02 ,  B65D85/86

CPC classification number: H05K13/0417

Abstract: Disclosed is a carrier tape feeder for a chip mounter. The carrier tape feeder includes: a body part; a rotation part, which is rotatably mounted on the body part and rotates by being engaged with a portion of a first carrier tape; a handle part, which is disposed by being separated by a predetermined distance from the outer circumferential surface of the rotation part, is rotatably mounted on the body part, and is selectively engaged with a second carrier tape; and a block part, which is rotatably mounted on the body part and exerts a force to the second carrier tape towards the rotation part according to rotation of the handle part.

Abstract translation: 公开了一种用于芯片安装机的载带馈线器。 载带输送机包括：主体部分; 旋转部，其被可旋转地安装在主体部分上并通过与第一载带的一部分接合而旋转; 通过与旋转部的外周面隔开预定距离而设置的把手部可旋转地安装在主体部上，并且选择性地与第二载带卡合; 以及块部，其被可旋转地安装在所述主体部上，并且根据所述手柄部的旋转对所述第二载带施加朝向所述旋转部的力。

公开(公告)号：WO2014025120A1

公开(公告)日：2014-02-13

申请号：PCT/KR2013/003424

申请日：2013-04-23

Applicant: SAMSUNG TECHWIN CO., LTD

Inventor： KIMIYUKI, Yamasaki

IPC: H05K13/02 ,  B65D73/02 ,  B65D85/86

CPC classification number: H05K13/0417

Abstract: Provided are a carrier tape feeding device, a chip mounting system, and a chip mounting method. The carrier tape feeding device includes: a transfer unit for transferring a first carrier tape and a second carrier tape sequentially to a chip mounting apparatus; a rotation unit selectively engaged to a part of the first carrier tape with which a part of the second carrier tape contacts, and for transferring the second carrier tape to the transfer unit; a detecting sensor unit for detecting sequential existence of the first carrier tape or the second carrier tape supplied to the transfer unit, and existence of the second carrier tape supplied to the rotation unit; and a controller for determining existence of the first carrier tape based on a signal detected by the detecting sensor unit, and controlling at least one of the transfer unit and the rotation unit to be driven based on the existence of the first carrier tape.

Abstract translation: 提供载带输送装置，芯片安装系统和芯片安装方法。 载带馈送装置包括：传送单元，用于将第一载带和第二载带顺序地传送到芯片安装装置; 旋转单元选择性地接合到所述第一载带的一部分与所述第二载带的一部分接触的部分，并且用于将所述第二载带传送到所述传送单元; 检测传感器单元，用于检测提供给转印单元的第一载带或第二载带的顺序存在以及提供给旋转单元的第二载带的存在; 以及控制器，用于基于由检测传感器单元检测到的信号来确定第一载带的存在，并且基于第一载带的存在来控制要驱动的传送单元和旋转单元中的至少一个。