公开(公告)号：WO2017132266A1

公开(公告)日：2017-08-03

申请号：PCT/US2017/014957

申请日：2017-01-25

Applicant: SANDIA CORPORATION

Inventor： BRANCH, Darren, W. ,  MILLER, Philip, R. ,  EDWARDS, Thayne, L. ,  WHEELER, David, R.

IPC: A61B50/00 ,  B29C65/48 ,  B31B1/60 ,  B65B7/16 ,  B65B51/02 ,  C09J4/00

CPC classification number: B01L3/502715 ,  B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/04 ,  B01L2300/0816 ,  B01L2300/0887 ,  B01L2300/16

Abstract: The present invention relates to encapsulated microfluidic packages and methods thereof. In particular embodiments, the package includes a device, a cradle configured to support the device, and a lid having a bonding surface configured to provide a fluidic seal between itself and the device and/or cradle. Other package configurations, as well as methods for making such fluidic seals, are described herein.

Abstract translation: 本发明涉及封装的微流体包装及其方法。 在特定实施例中，该包装包括装置，构造成支撑该装置的支架和具有结合表面的盖子，该结合表面构造成在其自身与该装置和/或支架之间提供流体密封。 本文描述了其他包装配置以及制造这种流体密封的方法。