公开(公告)号：WO2017192800A1

公开(公告)日：2017-11-09

申请号：PCT/US2017/030968

申请日：2017-05-04

Applicant: SENTINEL CONNECTOR SYSTEMS, INC.

Inventor： ROBINSON, Brett D. ,  WAGNER, Justin

IPC: H01R13/6581 ,  H01R13/6474 ,  H01R24/64 ,  H01R13/66 ,  H01R107/00

Abstract: A method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing.

Abstract translation: 一种制造高速插座的方法，所述方法包括以下步骤：形成包括用于接收插头的端口的壳体，所述端口包括多个引脚，每个引脚连接到所述插座中的对应信号线 形成围绕所述壳体的屏蔽罩，形成衬底的顶层，在所述衬底中的所述顶层的第一侧上的第一屏蔽层，与所述衬底中的所述第一屏蔽层相邻的第二屏蔽层，以及形成 与第二屏蔽层相邻的底层，形成延伸穿过衬底的多个第一通孔，其中每个第一通孔被配置为在外壳上容纳销，形成延伸穿过衬底的多个第二通孔，每个第二通孔被配置为 在外壳上放置一个插针。