Abstract:
The present invention provides a pixel array having a three-dimensional structure and an image sensor having the pixel array. The pixel array has a three-dimensional structure in which a photodiode, a transfer transistor, a reset transistor, a convert transistor, and a select transistor are divided and formed on a first wafer and a second wafer, chips on the first and second wafers are connected in a vertical direction after die-sorting the chips. The first wafer includes a plurality of photodiodes for generating electric charges corresponding to an incident video signal, a plurality of transfer transistors for transferring the electric charges generated by the photodiodes to floating diffusion regions, a plurality of STIs circling one of the photodiodes and one transfer transistor connected to the one photodiode, a first super-contact which extends from a lower portion of the plurality of the STIs to a lower surface of the wafer, and a second super-contact which penetrates the plurality of the STIs and a portion of the first super-contact. The electric charges accumulated in the floating diffusion regions are transferred to the second wafer through the second super-contact.
Abstract:
Provided is a unit pixel of an image sensor in which the number of contacts is reduced and a wiring area is also reduced. Therefore, it is possible to manufacture an image sensor having an ultra-fine pixel having a pixel size of about 2 to 3q by using a low process technology having 0.13 to 0.18q technology. The number of contact holes in the unit pixel of the image sensor according to the present invention is reduced, so that a wiring area is reduced, and when the layout is designed, a relatively low process technology can by applied. Therefore, there is an advantage in that costs allocated to apply the high process technology can be reduced.
Abstract:
Provided is an image sensor and a method of manufacturing the same. The image sensor includes anti-reflection films which are formed between a plurality of metal wire lines of the lowest metal wiring layer and a semiconductor substrate and between one of the metal wiring layers and another metal wiring layer. The image sensor having the anti-reflection films according to the present invention can reduce color crosstalk and noises in comparison with a conventional image sensor by using the anti-reflection films formed above the surroundings of the photodiodes.