METHODS AND APPARATUS FOR CLEANING, RINSING, AND DRYING WAFERS
    1.
    发明申请
    METHODS AND APPARATUS FOR CLEANING, RINSING, AND DRYING WAFERS 审中-公开
    清洁,冲洗和干燥的方法和装置

    公开(公告)号:WO1998001892A1

    公开(公告)日:1998-01-15

    申请号:PCT/US1997011830

    申请日:1997-07-08

    CPC classification number: H01L21/67028

    Abstract: The present invention relates to a wafer cleaning machine having an input station, a water track, a cleaning station, a rinsing station, a spin-dry station, and a load station. The input station includes two or more wafer supply areas for a continuous supply of wafers to the water track. After the wafers enter the water track from the input station, the wafers are transported down the track into the wafer cleaning station. The wafer cleaning station comprises a plurality of pairs of rollers which pull the wafers through the cleaning station and thereby clean the top and bottom flat surfaces of the wafers. A cleaning fluid manifold formed within the upper panel of the cleaning station facilitates effective distribution of the cleaning fluid to the rollers. From the cleaning station, the wafers are transported to a rinse station. From the rinsing station, the workpieces are transferred to a dual spin-dry station. At the spin-dry station, the workpieces are spun at a high speed to remove any residual water droplets or the like. From the dual spin-dry station, a robotic transfer arm removes the workpieces from the spin-dry station and places them in one o f a pair of unload cassettes. After the cassettes are filled with wafers, they are removed and transferred for subsequent processing.

    Abstract translation: 本发明涉及具有输入站,水道,清洁站,漂洗站,旋转干燥站和装载站的晶片清洗机。 输入站包括两个或更多晶片供应区域,用于连续供应水道的晶片。 在晶片从输入站进入水道之后,将晶片从轨道传送到晶片清洁站。 晶片清洁站包括多对辊,其将晶片拉过清洁台,从而清洁晶片的顶部和底部平坦表面。 形成在清洁站的上面板内的清洁流体歧管有助于清洁流体有效地分配到辊子上。 从清洁站,将晶片运送到冲洗站。 从冲洗站将工件转移到双旋转干燥站。 在旋转干燥站,工件以高速旋转以除去残留的水滴等。 从双旋转干燥站,机器人传输臂从旋转干燥站移除工件,并将它们放置在一对卸载盒中。 在盒被充满晶片之后,它们被移除并转移以用于后续处理。

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