公开(公告)号：WO1998021008A1

公开(公告)日：1998-05-22

申请号：PCT/US1997020374

申请日：1997-11-12

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  CESNA, Joseph, V. ,  GROSSLIGHT, Gordon, J. ,  KARLSRUD, Chris

IPC: B24B37/04

CPC classification number: B24B37/30 ,  Y10T279/11

Abstract: An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member. A detachable pressure plate is connected to the lower plate member by at least one quick release apparatus which utilizes a locking pin secured to the pressure plate and configured to fit through a bore in the lower plate member. In a second embodiment, the upper plate member has recesses in its top and bottom surfaces. The lower plate member includes recesses in its top surface which are aligned with the upper plate member. A plurality of springs held by connecting pins are disposed in the recesses, and a flexure spring is disposed between the upper and lower plate members.

Abstract translation: 在第一实施例中用于将工件接合抛光表面的装置包括下板构件，下板构件在顶表面上包括轮毂。 上板构件包括设置在底面上的座。 轮毂装配在座椅内以形成下板和上板构件之间的空气轴承。 结构向空气轴承供应空气，并且弯曲弹簧设置在上板和下板构件之间。 下板构件包括在其底表面中的真空孔，其连接到真空源，该真空源产生用于将工件保持抵靠下板的真空压力。 包括凸缘的保持环围绕下板构件的外边缘表面定位，用于将工件保持在下板构件的底表面上的适当位置。 一个可拆卸的压板通过至少一个快速释放装置连接到下板构件，该快速释放装置利用固定在压板上并被配置成通过下板构件中的孔配合的锁销。 在第二实施例中，上板构件在其顶表面和底表面上具有凹部。 下板构件在其顶表面中包括与上板构件对准的凹部。 通过连接销保持的多个弹簧设置在凹部中，并且弯曲弹簧设置在上板和下板构件之间。

公开(公告)号：WO1998008651A1

公开(公告)日：1998-03-05

申请号：PCT/US1997015380

申请日：1997-08-28

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  HOLZAPFEL, Paul

IPC: B24B37/04

CPC classification number: B24B53/017 ,  B24D7/06

Abstract: A conditioning device having (200) cubic boron nitride cutting elements (205) brazed-bonded to the bottom surface of the device and suitably adopted for conditioning a workpiece polishing pad by moving across the pad while in contact with the pad. The conditioning device (200) may further include a flange (202) extending about the bottom periphery of the device (200) with the cubic boron nitride cutting elements (205) being attached to the bottom surface of the flange (202). The flange (202) may include cutout portions for permitting material to escape from the interior of the device (200). The cubic boron nitride cutting elements (205) are distributed substantially uniformly across the bottom surface of the flange (202) and the elements are brazed-bonded to the flange with a braised metal alloy, creating an extremely strong bond between the cutting elements (205) and the flange (202) surface. Further, the conditioning ring may be attached to a plurality of wafer carrier elements (124) so that the conditioning process occurs during the actual polishing of the wafers (101), or the conditioning ring may be attached to a mechanical arm which engages the ring against the polishing pad between wafer polishing steps. In either case, to enhance the conditioning process, the carrier element and/or the mechanical arm suitably rotates the conditioning ring about its axis and oscillates the ring back and forth across the polishing pad.

Abstract translation: 一种具有（200）立方氮化硼切割元件（205）的调节装置，其钎焊接合到所述装置的底表面，并且适合用于通过在与所述垫接触的同时移动穿过所述垫来调节工件抛光垫。 调节装置（200）还可以包括围绕装置（200）的底部周边延伸的凸缘（202），立方氮化硼切割元件（205）附接到凸缘（202）的底表面。 凸缘（202）可以包括用于允许材料从装置（200）的内部逸出的切口部分。 立方氮化硼切割元件（205）基本上均匀地分布在凸缘（202）的底表面上，元件用炖金属合金钎焊到凸缘上，从而在切割元件（205）之间产生极强的粘结 ）和凸缘（202）表面。 此外，调节环可以附接到多个晶片载体元件（124），使得调节过程在晶片（101）的实际抛光期间发生，或者调节环可以附接到接合环的机械臂 在抛光步骤之间的抛光垫。 在任一情况下，为了增强调节过程，载体元件和/或机械臂适当地使调节环绕其轴线旋转并且振荡环绕抛光垫。

公开(公告)号：WO1998005066A2

公开(公告)日：1998-02-05

申请号：PCT/US1997013373

申请日：1997-07-23

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  HOLZAPFEL, Paul ,  ALLEN, Robert, F. ,  LIN, Warren ,  SCHLUETER, James ,  KARLSRUD, Chris

IPC: H01L21/66

CPC classification number: G01B11/0625 ,  B24B37/013 ,  B24B49/00 ,  H01L22/12 ,  H01L22/26

Abstract: The present invention provides methods and apparatus which permits in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a work piece, e.g., a semiconductor wafer. A probe (500) disposed proximate to the outer perimeter of a polishing pad (126) on a CMP table, such that the probe establishes optical contact with the wafer surface (304) as a portion of the wafer extends beyond the outer perimeter (330) of the polishing pad (126). A nozzle (312) may be provided to apply a stream of compressed air at the disk surface under inspection to thereby remove excess slurry from the local region of the workpiece being inspected. A broad band light source (322) is employed in conjunction with a fiber optic cable (318) to direct light at the wafer surface. A bifurcated probe is employed such that the light applied to the workpiece surface is reflected back to and captured by a corresponding optical sensor connected to a fiber optic cable (320). The captured reflected light received by the receptor sensor and fiber optic cable assembly is applied to a photospectrum meter (324) which analyzes the reflected light. An output signal from the photospectrum meter is transmitted to a processor (326) which includes a smart algorithm configured to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer.

Abstract translation: 本发明提供方法和装置，其允许在工件中，即时地，基本上实时地测量工件（例如半导体晶片）的表面层的实际厚度。 设置在CMP台上靠近抛光垫（126）的外周边的探针（500），使得当晶片的一部分延伸超过外周（330）时，探针与晶片表面（304）建立光学接触 ）抛光垫（126）。 可以设置喷嘴（312）以在被检查的盘表面处施加压缩空气流，从而从被检查的工件的局部区域移除多余的浆料。 与光纤电缆（318）结合使用宽带光源（322）以引导晶片表面的光。 采用分叉探针，使得施加到工件表面的光被反射回并连接到光纤电缆（320）的对应的光学传感器捕获。 由受体传感器和光纤电缆组件接收的捕获的反射光被施加到分析反射光的光谱仪（324）。 来自光谱仪的输出信号被传送到处理器（326），处理器（326）包括配置成计算表面层厚度的智能算法。 或者，半导体层的反射特性可能会影响反射信号的性质; 可以检测反射信号的变化，以指示何时从氧化物层去除金属层。

公开(公告)号：WO1998003305A1

公开(公告)日：1998-01-29

申请号：PCT/US1997012386

申请日：1997-07-16

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  ALLEN, Robert, F. ,  HOLZAPFEL, Paul ,  BARTELS, Anthony, L. ,  LIN, Warren

IPC: B24B37/04

CPC classification number: B24B37/0053 ,  B24B37/04 ,  B24B49/04 ,  B24B49/12 ,  G05B19/401 ,  G05B19/402 ,  G05B2219/23231 ,  G05B2219/36372 ,  G05B2219/37002 ,  G05B2219/37117 ,  G05B2219/37125 ,  G05B2219/37266 ,  G05B2219/37283 ,  G05B2219/37286 ,  G05B2219/37573 ,  G05B2219/45232

Abstract: An apparatus for use with a chemical mechanical planarization (CMP) system includes a light source that generates an interrogation signal and directs the interrogation signal toward a polishing pad configured to process a workpiece during the CMP procedure. A reflected signal produced in response to the interrogation signal is received by a detector, and the optical characteristics of the reflected signal are processed and analyzed to determine whether extraneous material is present within an area of the polishing pad. The apparatus may employ alternative light sources and processing techniques to advantageously operate in conjunction with a variety of polishing pads having different physical characteristics.

Abstract translation: 用于化学机械平面化（CMP）系统的装置包括产生询问信号的光源，并且将询问信号引导到在CMP过程期间被配置为处理工件的抛光垫。 响应于询问信号产生的反射信号由检测器接收，并且对反射信号的光学特性进行处理和分析，以确定外部材料是否存在于抛光垫的区域内。 该装置可以采用替代光源和处理技术来有利地与具有不同物理特性的各种抛光垫一起工作。

公开(公告)号：WO1996002355A1

公开(公告)日：1996-02-01

申请号：PCT/US1995001694

申请日：1995-02-08

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  KARLSRUD, Chris, E. ,  VAN WOERKOM, Anthony, G. ,  ODAGIRI, Shigeru ,  NAGAHASHI, Isao ,  PRFSTON, Spencer

IPC: B24B07/22

CPC classification number: B24B37/08 ,  B24B37/345 ,  B24B49/16 ,  B24B51/00 ,  G05B19/41825 ,  G05B2219/37399 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49356 ,  G05B2219/49361 ,  G05B2219/50007 ,  G05B2219/50362 ,  G05B2219/50371 ,  G05B2219/50381 ,  G05B2219/50388 ,  H01L21/67745 ,  H01L21/67751 ,  H01L21/6838 ,  Y02P90/087

Abstract: A wafer polishing apparatus (100) includes a wafer polishing assembly (132) having a plurality of wafer carriers (139-143) for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface (134). A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers (139-143) by wafer holding apparatus of an index table (117). Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers (139-143) into wafer holding apparatus of the index table (117). The wafer carriers (139-143) are individually computer (103) controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract translation: 晶片抛光装置（100）包括具有多个晶片载体（139-143）的晶片抛光组件（132），用于基本上同时抛光多个晶片抵靠旋转抛光表面（134）。 通过分度台（117）的晶片保持装置将待研磨的多个晶片基本上同时装载到多个晶片载体（139-143）中。 类似地，多个抛光晶片从多个晶片载体（139-143）基本上同时卸载到索引台（117）的晶片保持装置中。 晶片载体（139-143）是单独的计算机（103），用于精确抛光，并且可以通过不同的晶片载体同时满足不同的抛光要求。

公开(公告)号：WO1993025347A1

公开(公告)日：1993-12-23

申请号：PCT/US1993005541

申请日：1993-06-10

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  KARLSRUD, Chris, E. ,  VAN WOERKOM, Anthony, G. ,  ODAGIRI, Shigeru ,  NAGAHASHI, Isao

IPC: B24B37/04

CPC classification number: H01L21/6838 ,  B24B37/08 ,  B24B37/345 ,  B24B49/16 ,  B24B51/00 ,  G05B19/41825 ,  G05B2219/37399 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/45232 ,  G05B2219/49356 ,  G05B2219/49361 ,  G05B2219/50007 ,  G05B2219/50362 ,  G05B2219/50371 ,  G05B2219/50381 ,  G05B2219/50388 ,  H01L21/67745 ,  H01L21/67751 ,  Y02P90/087

Abstract: A wafer polishing apparatus (100) includes a wafer polishing assembly (132) having a plurality of wafer carriers (139-143) for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface (134). A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers (139-143) by wafer holding apparatus of an index table (117). Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers (139-143) into wafer holding apparatus of the index table (117). The wafer carriers (139-143) are individually computer (103) controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract translation: 晶片抛光装置（100）包括具有多个晶片载体（139-143）的晶片抛光组件（132），用于基本上同时抛光多个晶片抵靠旋转抛光表面（134）。 通过分度台（117）的晶片保持装置将待研磨的多个晶片基本上同时装载到多个晶片载体（139-143）中。 类似地，多个抛光晶片从多个晶片载体（139-143）基本上同时卸载到索引台（117）的晶片保持装置中。 晶片载体（139-143）是单独的计算机（103），用于精确抛光，并且可以通过不同的晶片载体同时满足不同的抛光要求。

公开(公告)号：WO1998012020A1

公开(公告)日：1998-03-26

申请号：PCT/US1997015560

申请日：1997-09-04

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  KIM, Inki

IPC: B24B37/04

CPC classification number: B24B37/26

Abstract: An apparatus for evenly polishing or planarizing the surfaces of workpieces comprising a polishing pad with a plurality of grooves along the surface of the pad for uniformly guiding a slurry radially outward across the surface of the pad. Preferably, the grooves are arc-shaped and extend radially outward from the center of the polishing pad to the outer edge of the pad, the angle of the arc being in the same direction as the angular rotation of the polishing pad; the grooves along the pad are cut in a U-shape or V-shape; and the grooves are equally spaced apart from each other along the surface of the pad.

Abstract translation: 一种用于均匀抛光或平坦化工件表面的装置，其包括具有沿衬垫表面的多个凹槽的抛光垫，用于将浆料沿衬垫的表面径向向外均匀地引导。 优选地，凹槽是弧形的并且从抛光垫的中心径向向外延伸到衬垫的外边缘，弧的角度与抛光垫的角度旋转方向相同; 沿着焊盘的槽被切成U形或V形; 并且所述凹槽沿着所述垫的表面彼此等间隔开。

公开(公告)号：WO1997047433A1

公开(公告)日：1997-12-18

申请号：PCT/US1997009901

申请日：1997-06-06

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  FRUITMAN, Clinton, O.

IPC: B24B37/04

CPC classification number: H01L21/31053 ,  B24B37/24 ,  H01L21/31051

Abstract: A lapping pad (31) used to polish wafers in a CMP process comprising a substantially flat surface (32) having relatively few surface irregularities (34). The lapping pad (31) is suitably made from a porous material which permits the adsorption and/or entrainment of suitable slurries, for example, aqueous high pH slurries comprising colloidal silica, or the like. Moreover, pad (31) is relatively pliable to permit the undersurface of pad (31) to conform to the global topography of a workpiece (12) being polished without damaging the delicate microstructures (24) associated with workpiece (12) as pressures are applied between pad (31) and workpiece (12). Finally, the flat surface (32) of pad (31) urges particles (14) onto surface (18) of workpiece (12) more uniformly, thereby resulting in a more uniform planar surface (18) of workpiece (12).

Abstract translation: 用于在CMP工艺中抛光晶片的研磨垫（31），其包括具有相对较少的表面不规则（34）的基本平坦的表面（32）。 研磨垫（31）适当地由多孔材料制成，其允许吸附和/或夹带合适的浆料，例如含有胶体二氧化硅的含水高pH浆料等。 此外，垫（31）相当柔韧以允许垫（31）的下表面符合正被抛光的工件（12）的全局形貌，而不会在施加压力时损坏与工件（12）相关联的精细微结构（24） （31）和工件（12）之间。 最后，垫（31）的平坦表面（32）更均匀地将颗粒（14）推到工件（12）的表面（18）上，从而导致工件（12）的更均匀的平坦表面（18）。

公开(公告)号：WO1998001892A1

公开(公告)日：1998-01-15

申请号：PCT/US1997011830

申请日：1997-07-08

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  PETERSON, Glenn, E. ,  SHURTLIFF, Eric ,  GOUDIE, Chad ,  NATALICIO, John ,  OLSEN, Greg

IPC: H01L21/00

CPC classification number: H01L21/67028

Abstract: The present invention relates to a wafer cleaning machine having an input station, a water track, a cleaning station, a rinsing station, a spin-dry station, and a load station. The input station includes two or more wafer supply areas for a continuous supply of wafers to the water track. After the wafers enter the water track from the input station, the wafers are transported down the track into the wafer cleaning station. The wafer cleaning station comprises a plurality of pairs of rollers which pull the wafers through the cleaning station and thereby clean the top and bottom flat surfaces of the wafers. A cleaning fluid manifold formed within the upper panel of the cleaning station facilitates effective distribution of the cleaning fluid to the rollers. From the cleaning station, the wafers are transported to a rinse station. From the rinsing station, the workpieces are transferred to a dual spin-dry station. At the spin-dry station, the workpieces are spun at a high speed to remove any residual water droplets or the like. From the dual spin-dry station, a robotic transfer arm removes the workpieces from the spin-dry station and places them in one o f a pair of unload cassettes. After the cassettes are filled with wafers, they are removed and transferred for subsequent processing.

Abstract translation: 本发明涉及具有输入站，水道，清洁站，漂洗站，旋转干燥站和装载站的晶片清洗机。 输入站包括两个或更多晶片供应区域，用于连续供应水道的晶片。 在晶片从输入站进入水道之后，将晶片从轨道传送到晶片清洁站。 晶片清洁站包括多对辊，其将晶片拉过清洁台，从而清洁晶片的顶部和底部平坦表面。 形成在清洁站的上面板内的清洁流体歧管有助于清洁流体有效地分配到辊子上。 从清洁站，将晶片运送到冲洗站。 从冲洗站将工件转移到双旋转干燥站。 在旋转干燥站，工件以高速旋转以除去残留的水滴等。 从双旋转干燥站，机器人传输臂从旋转干燥站移除工件，并将它们放置在一对卸载盒中。 在盒被充满晶片之后，它们被移除并转移以用于后续处理。

公开(公告)号：WO1995018697A1

公开(公告)日：1995-07-13

申请号：PCT/US1994014804

申请日：1994-12-20

Applicant: SPEEDFAM CORPORATION

Inventor： SPEEDFAM CORPORATION ,  CESNA, Joseph, V. ,  VAN WOERKOM, Anthony, G.

IPC: B24B01/00

CPC classification number: B24B53/017 ,  B24B53/10

Abstract: A device (18) for conditioning the surface of a polishing pad (15) covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element (20) carrying cutting means (25) on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad (15) and which is adapted for oscillating horizontal movement over the surface of the polishing pad (15). The cutting means (25) are dispersed in a circular or ring configuration.

Abstract translation: 一种用于调节覆盖安装在抛光机上用于围绕垂直轴线旋转的压板的抛光垫（15）的表面的装置（18），包括在其底表面上承载切割装置（25）的刚性载体元件（20） 其适于垂直移动进入和离开与抛光垫（15）的表面接合，并且适于在抛光垫（15）的表面上摆动水平运动。 切割装置（25）以圆形或环形分布。