Abstract:
A non-contact edge coating apparatus includes an applicator (821) for applying a coating material on an edge of a solar cell substrate (801) and a control system (900) configured to drive the applicator (821). The control system (900) may drive the applicator (821) along an axis to maintain a distance with an edge of the substrate (801) as the substrate (801) is rotated to have the edge coated with a coating material. The applicator (821) may include a recessed portion (825) into which the edge of the substrate (801) is received for edge coating. For example, the applicator (821) may be a roller with a groove. Coating material may be introduced into the groove for application onto the edge of the substrate (801). A variety of coating materials may be employed with the apparatus including hot melt ink and UV curable plating resist.
Abstract:
An edge coating apparatus (300) is configured to apply a coating material to an edge of a non-circular solar cell substrate (371). The substrate (371) is placed on a rotatable substrate support in the form of a chuck (303) configured to hold and rotate the substrate (371). A coating material dispenser (308) includes an applicator in the form of a roller (309) having a recessed portion in the form of a groove (310). During the edge coating process, the roller (309) is positioned such that the edge of the substrate (371) is received in the groove (310). Knurled surface of the roller (309) contacts the edge of the substrate (371) to apply the coating material to the edge of the substrate (371). A motor (307) rotates the chuck (303) by way of a transmission belt (306) and a shaft (305-1, 305-2) to rotate the substrate (371) for edge coating.
Abstract:
A non-contact edge coating apparatus (100) applies coating material to an edge of a non-circular solar cell substrate (101) without physical contact. The apparatus (100) may include a rotatable substrate support (113) configured to hold the substrate (101). The apparatus (100) may further include an applicator (121) configured to receive a coating material and apply the coating material to an edge of the substrate (101) while the substrate (101) is rotated without any portion of the applicator (121) physically touching the edge of the substrate. The substrate support (113) may be mechanically coupled to a cam (112), which contacts a follower (123) mechanically coupled to the applicator (121). A variety of coating materials may be employed with the apparatus (100) including hot melt ink and UV curable plating resist.
Abstract:
One embodiment relates to a dopant material for manufacturing solar cells. The dopant material (100) includes a primary carrier (102) and a dopant system. The primary carrier is a solid at a lower temperature, a liquid at an elevated temperature, and decomposes at a third temperature higher than the elevated temperature. The dopant material is dispensible in a controlled manner at the elevated temperature to a defined area of a silicon substrate at the lower temperature. The dopant system includes a dopant carrier (104) and dopant source (106). The dopant source (106) is stable at the third temperature. Other embodiments, aspects and features are also disclosed.
Abstract:
A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non-conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame. In use, the carrier can support a high number of units for processing with no significant mechanical stress being transferred to the wafers during loading and unloading from the carrier. The carriers and wafers can be transferred easily for different chemical baths and can be handled safely during rinsing and drying steps.
Abstract:
In one embodiment, a solar cell (100) is fabricated using an ink pattern as a mask for a processing step. The ink pattern may comprise an ink (110) that is substantially devoid of particles that may scratch a surface on which the ink pattern is formed. The ink pattern may be formed by screen printing. In one embodiment, the ink pattern is formed on an oxide layer and comprises an ink (110) that is substantially free of silicon dioxide particles. The ink pattern may be employed as an etching or deposition mask, for example.
Abstract:
A modular support element (1) for a display structure (100) can be secured to at least one other element (1a) identical thereto by securing means (11) and complementary securing means (12) respectively provided on one and the other of the support elements. The means and complementary means can be coupled to each other so as to slide between a first coupling position in which the respective support elements are rigidly secured to each other and a second coupling position in which the respective support elements are secured to each other with the facility for relative rotation about an axis of rotation (X).
Abstract:
A graphics-carrying device (1) comprises a support (2) having a front surface (8) and a rear surface (9) which are arranged opposite each other and between which a seat (5) for holding a panel (3) is defined, in such a manner that the front surface is exposed to view, in order to show the panel, in at least one condition of use of the device. The device also comprises a structure (10) for mounting the first support, to which the first support is articulated in such a manner as to be movable between a first operative position in which it is arranged close to the structure with the front surface exposed to view, and a second operative position in which it projects from the structure and is supported thereon in the manner of an angle bracket.