Abstract:
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body (102 and 202) on which the substrates are to be held. Electrically-conductive lines (128) are embedded within the carrier body, and a plurality of contact clips (802 or 900 or 1000) are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
Abstract:
An edge coating apparatus (300) is configured to apply a coating material to an edge of a non-circular solar cell substrate (371). The substrate (371) is placed on a rotatable substrate support in the form of a chuck (303) configured to hold and rotate the substrate (371). A coating material dispenser (308) includes an applicator in the form of a roller (309) having a recessed portion in the form of a groove (310). During the edge coating process, the roller (309) is positioned such that the edge of the substrate (371) is received in the groove (310). Knurled surface of the roller (309) contacts the edge of the substrate (371) to apply the coating material to the edge of the substrate (371). A motor (307) rotates the chuck (303) by way of a transmission belt (306) and a shaft (305-1, 305-2) to rotate the substrate (371) for edge coating.
Abstract:
A non-contact edge coating apparatus (100) applies coating material to an edge of a non-circular solar cell substrate (101) without physical contact. The apparatus (100) may include a rotatable substrate support (113) configured to hold the substrate (101). The apparatus (100) may further include an applicator (121) configured to receive a coating material and apply the coating material to an edge of the substrate (101) while the substrate (101) is rotated without any portion of the applicator (121) physically touching the edge of the substrate. The substrate support (113) may be mechanically coupled to a cam (112), which contacts a follower (123) mechanically coupled to the applicator (121). A variety of coating materials may be employed with the apparatus (100) including hot melt ink and UV curable plating resist.
Abstract:
In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a space between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.
Abstract:
A non-contact edge coating apparatus includes an applicator (821) for applying a coating material on an edge of a solar cell substrate (801) and a control system (900) configured to drive the applicator (821). The control system (900) may drive the applicator (821) along an axis to maintain a distance with an edge of the substrate (801) as the substrate (801) is rotated to have the edge coated with a coating material. The applicator (821) may include a recessed portion (825) into which the edge of the substrate (801) is received for edge coating. For example, the applicator (821) may be a roller with a groove. Coating material may be introduced into the groove for application onto the edge of the substrate (801). A variety of coating materials may be employed with the apparatus including hot melt ink and UV curable plating resist.
Abstract:
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body (102 and 202) on which the substrates are placed and conductive lines (128) embedded within the carrier body. A plurality of conductive clip attachment parts (130) are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips (802 or 900 or 1000) are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.