TAPE-SHAPED REACTIVE ADHESIVE SYSTEM
    1.
    发明申请

    公开(公告)号:WO2023066944A1

    公开(公告)日:2023-04-27

    申请号:PCT/EP2022/078992

    申请日:2022-10-18

    Applicant: TESA SE

    Abstract: The aim was to provide a tape-shaped adhesive system for assembly applications that can be applied easily and precisely in position and then quickly develops an adhesive force that is at least sufficient to fix the parts to be assembled. This is achieved with a tape-shaped adhesive system, comprising • a) a carrier layer containing at least one silicone and at least one filler; and • b) at least one chemically pre-crosslinked outer layer which can be further crosslinked with moisture, comprising • - at least one polymer with at least two terminal silyl groups according to formula (1) Si(R1)a(R2)b (1), wherein the radicals R1 independently of one another represent an alkyl, alkenyl or aryl group or a hydrogen atom, the radicals R2 independently of one another represent a group which can be cleaved off with water, and b = 1, 2 or 3 and a = 3 - b; and • - at least one condensation catalyst. Further subject matter of the invention are a method for producing a tape-shaped adhesive system according to the invention and the use of a tape-shaped adhesive system according to the invention as an adhesive in the production of assembly bonds.

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