公开(公告)号：WO2023022992A1

公开(公告)日：2023-02-23

申请号：PCT/US2022/040356

申请日：2022-08-15

Applicant: TESLA, INC.

Inventor： KRITHIVASAN, Vijaykumar ,  ZHAO, Jin ,  LI, Jianjun

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/00

Abstract: A field programmable solder BeTA (FPSBGA) module may be utilized to assemble PCB/Substrate in any stack-up configuration. The local field programmable soldering BGA includes control system provides the necessary feedback for effective control of thermal profiles. The FPSBGA enables a control component (110) to cause the execution of the temperature application component (120) to cause a non-uniform application of specified temperature parameters to the substrate.

公开(公告)号：WO2023022991A1

公开(公告)日：2023-02-23

申请号：PCT/US2022/040353

申请日：2022-08-15

Applicant: TESLA, INC.

Inventor： ZHAO, Jin ,  SUN, Shishuang ,  SUN, Yang ,  KRITHIVASAN, Vijaykumar ,  CHANG, William ,  LI, Jianjun

IPC: G06F1/26

Abstract: Aspects of this disclosure relate to power delivery to chips in an array. An array of power conversion paths can be positioned vertically relative to the chips of the array. A power conversion path can convert a high voltage, low current signal to a low voltage, high current. The power conversion path can include a first power conversion stage and a second power conversion stage. The power conversion path can be implemented in a power supply module, for example.

公开(公告)号：WO2022192034A1

公开(公告)日：2022-09-15

申请号：PCT/US2022/018348

申请日：2022-03-01

Applicant: TESLA, INC.

Inventor： PANG, Mengzhi ,  SUN, Yang ,  LI, Yong guo ,  LI, Jianjun ,  NAVARRETE, Rodrigo Rodriguez ,  KRITHIVASAN, Vijaykumar ,  BHANDARI, Rishabh

IPC: H01L23/552 ,  H01L23/36 ,  H01L23/60 ,  H01L25/065 ,  H01L25/16

Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.