公开(公告)号：WO2022192031A1

公开(公告)日：2022-09-15

申请号：PCT/US2022/018277

申请日：2022-03-01

申请人： TESLA, INC.

发明人： NASR, Mohamed ,  NABOVATI, Aydin ,  ONG, Aldrich Chester L. ,  MILLER, Jeffrey John

IPC分类号： H05K7/20

摘要： A cold plate with an integrated sliding pedestal and a processing system including the same are provided. In one aspect, the processing system includes a printed circuit board (PCB), a first electronic component arranged over the PCB, and a thermal interface material (TIM) arranged over the first electronic component. The system includes at least one sliding pedestal arranged over the TIM. The sliding pedestal is configured to be spaced a variable distance from the PCB. The system also includes a cold plate arranged over the sliding pedestal and configured to provide a coolant to the sliding pedestal and to cool a second electronic component.

公开(公告)号：WO2023023024A1

公开(公告)日：2023-02-23

申请号：PCT/US2022/040419

申请日：2022-08-16

申请人： TESLA, INC.

发明人： NASR, Mohamed ,  LICHY, Samuel ,  NABOVATI, Aydin ,  BHANDARI, Rishabh ,  LI, Yong guo ,  GAO, Zheng

IPC分类号： H05K7/20 ,  G06F1/20

摘要： Electronic assemblies with a cold plate having an opening are provided. In one aspect, a system includes an array of electronic components, a control board, and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

公开(公告)号：WO2023023090A1

公开(公告)日：2023-02-23

申请号：PCT/US2022/040509

申请日：2022-08-16

申请人： TESLA, INC.

发明人： NABOVATI, Aydin ,  NASR, Mohamed ,  HESCHKE, Mitchell ,  GAO, Zheng ,  KRITHIVASAN, Vijaykumar

IPC分类号： G06F1/20

摘要： The systems, methods, and devices disclosed herein relate to sandwiched multi-layer structures for cooling electronics. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer, the first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. In some embodiments, at least one layer can use system on wafer packaging.

公开(公告)号：WO2023022939A1

公开(公告)日：2023-02-23

申请号：PCT/US2022/040204

申请日：2022-08-12

申请人： TESLA, INC.

发明人： BHANDARI, Rishabh ,  LI, Yong guo ,  NASR, Mohamed ,  LICHY, Samuel ,  NABOVATI, Aydin ,  FARZINAZAR, Shiva ,  HESCHKE, Mitchell

IPC分类号： H05K5/00 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24

摘要： An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

公开(公告)号：WO2022245740A1

公开(公告)日：2022-11-24

申请号：PCT/US2022/029463

申请日：2022-05-16

申请人： TESLA, INC.

发明人： NABOVATI, Aydin ,  PANG, Mengzhi ,  NASR, Mohamed

IPC分类号： H01L23/373 ,  H01L23/42 ,  H01L21/48

摘要： Electronic assemblies such as system on a wafer assemblies are disclosed. The assembly can include an electronic component that has a first side, a heat removing structure that is coupled to the first side of the electronic component, and a thermal interface structure that includes a thermal interface layer and an adhesion layer. The electronic component can be a system on a wafer (SoW). The thermal interface layer is positioned between the first side of the electronic component and the heat dissipation structure. The adhesion layer is positioned between the heat removing structure and the thermal interface layer. With the thermal interface structure, the electronic component and the heat removing structure can be attached together with relatively lower pressure.