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公开(公告)号:WO2016100987A1
公开(公告)日:2016-06-23
申请号:PCT/US2015/067227
申请日:2015-12-21
Inventor: LI, Haiying , SUTTON, Benjamin, Michael , LI, Ming
IPC: H01F27/30 , H01F41/084
CPC classification number: H01F27/2804 , H01F17/0006 , H01F17/0033 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F41/041 , H01F41/043 , H01F41/127
Abstract: In described examples, a coil assembly includes a laterally disposed ferrite ring (150) having a central opening (152). A laterally disposed annular conductive member (186) is positioned above the ferrite ring (150) and has spaced-apart circumferential segments. Bond wires (154) are connected at opposite ends thereof to outer and inner portions of the spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring (150) and the bond wires (154).
Abstract translation: 在所述实施例中,线圈组件包括具有中心开口(152)的横向设置的铁氧体环(150)。 横向设置的环形导电构件(186)位于铁氧体环(150)的上方并且具有间隔开的周向段。 接合线(154)的相对端连接到间隔开的周向段的外部和内部。 一层模具化合物覆盖铁氧体环(150)和接合线(154)。
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公开(公告)号:WO2016100988A1
公开(公告)日:2016-06-23
申请号:PCT/US2015/067228
申请日:2015-12-21
Inventor: LI, Haiying , SUTTON, Benjamin, Michael , LI, Ming
IPC: H01F27/30 , H01F41/084
CPC classification number: H01F27/2804 , H01F17/0033 , H01F17/045 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F27/327 , H01F41/041 , H01F41/127 , H01F2027/2809 , H01F2027/2814
Abstract: In described examples, an embedded coil assembly (100) includes a ferrite ring (150) having an annular axis. The ferrite ring (150) is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures (190) extend over the ferrite ring (150) and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring (150) and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring (150). An encapsulation layer covers the ferrite ring (150) and at least a portion of the conductive structures (190).
Abstract translation: 在所描述的示例中,嵌入式线圈组件(100)包括具有环形轴线的铁氧体环(150)。 铁氧体环(150)位于导电金属表面上。 多个分离的间隔开的导电结构(190)在铁氧体环(150)之上延伸并且在位于铁氧体环(150)的环形轴线的径向外侧的导电表面的第一区域中附接到导电金属表面, 并且在位于铁氧体环(150)的环形轴线的径向内侧的导电表面的第二区域中。 封装层覆盖铁氧体环(150)和至少一部分导电结构(190)。
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