Abstract:
Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.
Abstract:
The present disclosure relates to a circuit for suppressing unwanted magnetic interference. The circuit can have a transformer (410) having a first coil (418a), a first pair of input terminals (412a, 412b), and a first pair of output terminals. The transformer can produce a first magnetic field. The circuit can also have a harmonic trap (430). The harmonic trap has a second coil and a second pair of input terminals (432a, 432b) operably coupled to the first pair of input terminals. The harmonic trap can produce a second magnetic field opposing the first magnetic field. The harmonic trap can suppress electrical signals of at least one of the first input terminals and the first output terminals of the transformer at a resonant frequency of the harmonic trap. The harmonic trap can also suppress the first magnetic field in a far field.
Abstract:
Ce transformateur comporte des pistes primaire (10) et secondaire (20), couplées l'une à l'autre par mutuelle inductance, les pistes primaire et secondaire étant superposées l'une au-dessus de l'autre dans deux plans parallèles, tout en étant conformées pour suivre un même contour (C), le plan de la piste primaire correspondant à la couche conductrice principale du circuit, déposée sur un substrat (30), et la piste secondaire étant supportée, à l'aplomb de la piste primaire, par des moyens de support comportant des muret (41-46; 51-56), chaque muret prenant appui directement sur le substrat et sur une surface inférieure (24) de la piste secondaire (20), ayant une longueur (L) supérieure à une largeur (I), et présentant une hauteur permettant de ménager un intervalle prédéterminé entre une surface supérieure (14) de la piste primaire (10) et la surface inférieure (24) de la piste secondaire (20).
Abstract:
Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.
Abstract:
According to various aspects, exemplary embodiments are disclosed of common mode chokes. Also disclosed are methods for making or manufacturing common mode chokes.In some exemplary embodiments,common mode chokes comprise a generally rectangular body having opposing first and second ends, and including a lower ferrite portion,an upper ferrite portion,and at least one pair of laterally spaced-apart interior conductors within the body generally between the upper and lower ferrite portions and longitudinally extending from about the first end to about the second end of the generally rectangular body. The common mode choke may also include a non-magnetic ferrite dielectric within the body and disposed laterally between the at least one pair of interior conductors.
Abstract:
A low-profile passive-on-package is provided that includes a plurality of recesses that receive corresponding interconnects. Because of the receipt of the interconnects in the recesses, the passive-on-package has a height that is less than a sum of a thickness for the substrate and an interconnect height or diameter.
Abstract:
An integrated Microelectromechanical Systems ("MEMS") device. The MEMS device comprises a substrate, a transition portion (1008), and a differential inductor (1000). The transition portion is connected to and at least partially extends transversely away from a major surface of the substrate. The differential inductor is mechanically suspended above a major surface of the substrate at least partially by the transition portion. The differential inductor is also electrically connected to an electronic circuit external thereto by the transition portion. A first dielectric gap exists between the major surface of the substrate and the differential inductor.
Abstract:
This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.