公开(公告)号：WO1997020339A1

公开(公告)日：1997-06-05

申请号：PCT/US1996018298

申请日：1996-11-13

Applicant: THE WHITAKER CORPORATION

Inventor： THE WHITAKER CORPORATION ,  TAYLOR, Attalee, S. ,  TRAN, Mai, Loan, T. ,  BRIGHT, Edward, J.

IPC: H01L21/00

CPC classification number: H05K7/1023 ,  G01R1/0408

Abstract: An electronic package (4, 104) mounted on a tape carrier (2, 102)has a plurality of leads (6, 106) extending across an aperture (8, 108) in the tape carrier. A socket for the electronic package includes a cover (14, 114) having a tape mounting surface (44, 144, 148) for receiving the tape carrier in a controlled position thereagainst. A plurality of ribs (30, 130) protruding from the tape mounting surface are arranged so as to extend through the aperture (8, 108), and adjacent pairs of the ribs are arranged to straddle respective ones of the leads (6, 106) when the tape carrier is in the controlled position. A housing (12, 112) mateable with the cover holds a plurality of contacts (20, 120) engageable with the plurality of leads. As the cover is mated with the housing, the leads are straddled and guided by the adjacent pairs of ribs into engagement with their respective leads.

Abstract translation: 安装在带载体（2,102）上的电子封装（4,104）具有穿过带载体中的孔（8,108）延伸的多个引线（6,106）。 用于电子封装的插座包括具有带安装表面（44,144,148）的盖子（14,114），用于在其上的受控位置接收带状载体。 从带安装表面突出的多个肋（30,130）被布置成穿过孔（8,108）延伸，并且相邻的一对肋布置成跨越引线（6,106）中的相应引线， 当载带台处于受控位置时。 与盖配合的壳体（12,112）保持与多个引线接合的多个触头（20,120）。 当盖与壳体配合时，引线被相邻的肋对跨接并引导，与它们各自的引线接合。

公开(公告)号：WO1997020454A1

公开(公告)日：1997-06-05

申请号：PCT/US1996018206

申请日：1996-11-13

Applicant: THE WHITAKER CORPORATION

Inventor： THE WHITAKER CORPORATION ,  TAYLOR, Attalee, S.

IPC: H05K07/10

CPC classification number: H01R13/2478 ,  H01R12/714 ,  H01R13/2485 ,  H05K7/1084

Abstract: A socket (6) for an electronic package (2) comprises a dielectric housing (10) having contacts (20) each with a surface mount section (50) extending below a bottom surface (14) of the housing for engagement with a respective circuit trace on a circuit board. The surface mount section (50) of each contact has a convex bottom surface (52) with a shape which simulates at least a lower surface portion of a solder ball, whereby the socket imitates the footprint of a ball grid array package.

Abstract translation: 一种用于电子封装（2）的插座（6）包括具有触头（20）的电介质壳体（10），每个触头都具有在壳体的底表面（14）下方延伸的表面安装部分（50），用于与相应的电路 跟踪在电路板上。 每个接触件的表面安装部分（50）具有凸形底表面（52），其形状模拟焊球的至少下表面部分，由此插座模仿球栅阵列封装的覆盖区。