PASSIVE COMPONENT
    1.
    发明申请
    PASSIVE COMPONENT 审中-公开
    被动组件

    公开(公告)号:WO1998014039A1

    公开(公告)日:1998-04-02

    申请号:PCT/IB1997000888

    申请日:1997-07-17

    Abstract: In this application, a description is given of a passive component comprising two electric connections with a plug-in portion for securing and electrically connecting the component to a printed circuit board, for example an electrolytic capacitor. In accordance with the invention, this component is so constructed that both plug-in portions are provided with two pins, with the plug-in portions being so positioned that the four pins do not extend in a flat plane. By virtue of the measure in accordance with the invention, resoldering of such components can be dispensed with. The use of pins whose length and width are different enables the manual installation of the components in accordance with the invention in the correct position to be simplified.

    Abstract translation: 在本申请中,给出了一种无源元件的描述,该无源部件包括具有插入部分的两个电连接,用于固定和电连接该部件到印刷电路板,例如电解电容器。 根据本发明,该部件被构造成使得两个插入部分设置有两个销,插入部分被定位成使得四个销不在平面内延伸。 凭借根据本发明的措施,可以省去这些部件的分解。 使用长度和宽度不同的销可以将根据本发明的部件手动安装在正确的位置以被简化。

    ELECTRICAL CONNECTOR
    2.
    发明申请
    ELECTRICAL CONNECTOR 审中-公开
    电连接装置

    公开(公告)号:WO1997043886A1

    公开(公告)日:1997-11-20

    申请号:PCT/EP1997002289

    申请日:1997-05-06

    CPC classification number: H01R13/2414 G01R1/0433 H05K7/1023

    Abstract: In an electrical connector for connecting electric terminals (4) of a component (3), especially a semiconductor component, to corresponding connecting leads (5), especially on a printed circuit board (2), there is a spring device (14) with electrically conductive through components (16) between the connecting leads (5) and the movable contacts (8). One end of these through components (16) is connected under pressure to the connecting leads (5) and the other to the contacts (8). The contacts (8) take the form of an end-pivoted pressure lever for the spring device (14).

    Abstract translation: 在一个电连接装置,用于连接的电端子(4),其设置有各自的,特别是在印刷电路板上的部件(3),特别是半导体装置(2)的连接线(5)和可动接点片之间的连接线(5)( 8)提供了一种弹簧装置(14)具有通构件(16)是导电的。 此通道部件(16)在它们的一个端部到所述连接线(5),并且在其与所述接触片(8)在压力接触另一端。 接触件(8)形成为端可旋转地安装压杆对于所述弹簧装置(14)。

    ELECTRICAL DEVICE, ESPECIALLY A CONNECTING AND CONTROL DEVICE FOR MOTOR VEHICLES
    3.
    发明申请
    ELECTRICAL DEVICE, ESPECIALLY A CONNECTING AND CONTROL DEVICE FOR MOTOR VEHICLES 审中-公开
    电气设备,特别是电动车辆的连接和控制装置

    公开(公告)号:WO1993009656A1

    公开(公告)日:1993-05-13

    申请号:PCT/DE1992000743

    申请日:1992-09-04

    Abstract: Owing to the increasing range of functions of the components (28, 32), connecting and control devices can be exposed to damaging thermal loads. In the present device the power component (28) with the high power losses of the components (28, 32) is separated from a printed circuit board (31) which carries only signal processing components (32) and fitted on an inner side (24) of an outer wall (25) of the housing (11) having a high heat radiation capacity with the interposition of a substrate. The substrate (23) takes the form of heat conducting foil and has connector tracks via which the power component (26) is put into contact via a printed circuit board contact plug (28) with signal processing components (32) on the printed circuit board (31) and also via a divisible contact strip (12) with the external connection elements of the electric device. This connecting and control device is preferably fitted in motor vehicles.

    DUAL IN-LINE PACKAGE CARRIER ASSEMBLY
    4.
    发明申请
    DUAL IN-LINE PACKAGE CARRIER ASSEMBLY 审中-公开
    双重在线包装机组装

    公开(公告)号:WO1985005006A1

    公开(公告)日:1985-11-07

    申请号:PCT/US1985000537

    申请日:1985-03-29

    CPC classification number: H05K7/1046

    Abstract: DIP carrier assembly comprises carrier (10) having support surface (12) with apertures (13) therethrough to channels (22) in side and bottom of carrier into which DIP leads (4) are formed. Terminals (50) aligned in channels (37) in opposed sidewalls (36) of socket (30) apply releasing force on carrier when DIP leads deflect contact portions (56) of terminals. Release of resilient latch (40, 41) on socket causes ejection of carrier.

    SELECTIVELY ENGAGEABLE INTERFACE FOR CIRCUIT CARDS
    5.
    发明申请
    SELECTIVELY ENGAGEABLE INTERFACE FOR CIRCUIT CARDS 审中-公开
    用于电路卡的选择性可接口的接口

    公开(公告)号:WO1995030325A1

    公开(公告)日:1995-11-09

    申请号:PCT/US1995003284

    申请日:1995-03-17

    Abstract: An interface apparatus provides an auxiliary interface between an electronic base unit and a circuit card (300). The auxiliary interface apparatus may provide an RF interface between a notebook computer and a PCMCIA circuit card. The auxiliary interface apparatus includes an auxiliary base connector (290) attached to the base unit, an auxiliary card connector (350) attached to the circuit card (300), and an actuator device (250B). The actuator device moves the auxiliary base connector between a first position, in which the auxiliary base connector does not make contact with the auxiliary card connector, and a second position, in which the auxiliary base connector does make contact with the auxiliary card connector. The actuator device preferably includes a rack (270B) and a pinion gear (280B).

    Abstract translation: 接口装置提供电子基座单元和电路卡(300)之间的辅助接口。 辅助接口装置可以在笔记本计算机和PCMCIA电路卡之间提供RF接口。 辅助接口装置包括附接到基座单元的辅助基座连接器(290),附接到电路卡(300)的辅助卡连接器(350)和致动器装置(250B)。 致动器装置使辅助基座连接器在辅助基座连接器不与辅助卡连接器接触的第一位置和辅助基座连接器与辅助卡连接器接触的第二位置移动。 致动器装置优选地包括齿条(270B)和小齿轮(280B)。

    INTERCONNECTION SYSTEMS FOR ELECTRICAL CIRCUITS
    6.
    发明申请
    INTERCONNECTION SYSTEMS FOR ELECTRICAL CIRCUITS 审中-公开
    电路互连系统

    公开(公告)号:WO1987006092A1

    公开(公告)日:1987-10-08

    申请号:PCT/GB1987000203

    申请日:1987-03-24

    CPC classification number: H05K7/023 H01R12/78

    Abstract: Electrical circuits can be built up in three dimensions by using spacers (20, 20') which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks (120) which have a number of continuous tracks (110). Link members (126, 128) are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission stacks.

    Abstract translation: 电路可以通过使用互锁在一起以限定叠层的间隔件(20,20')三维地构成。 堆叠可用于将相邻间隔物之间​​的芯片载体夹持在一起,或者提供具有多个连续轨道(110)的功率和信号传输堆叠(120)。 链路成员(126,128)用于在芯片载体堆叠中的芯片载体和功率和信号传输堆叠的轨道之间提供电连接装置。

    ELECTRICAL CONNECTOR DEVICE
    7.
    发明申请
    ELECTRICAL CONNECTOR DEVICE 审中-公开
    电气连接器装置

    公开(公告)号:WO1986001674A1

    公开(公告)日:1986-03-13

    申请号:PCT/GB1985000381

    申请日:1985-08-23

    Inventor: POLYHITECH

    CPC classification number: H01R29/00 H01R12/7076 H01R13/70 H05K7/1007

    Abstract: An electrical connector device (5) for use in providing electrical connections between two circuit elements (1, 3) such as an integrated circuit device (1) and a printed circuit board (3), comprises a housing (6) carrying a plurality of switching arrangements each comprising terminals (8, 9) for connection to the two elements (1, 3) respectively, and a switching element (11) adapted and arranged to proved selective connections to either one of the terminals (8, 9) or between the two terminals (8, 9) thereby permitting monitoring or testing of connections to and between the elements (1, 3).

    Abstract translation: 一种用于在诸如集成电路装置(1)和印刷电路板(3)的两个电路元件(1,3)之间提供电连接的电连接器装置(5)包括:承载多个 分别包括用于连接到两个元件(1,3)的端子(8,9)和开关元件(11)的开关装置,以及开关元件(11),其适于和布置成用于证明对任一个端子(8,9)的选择性连接,或者 两个端子(8,9)从而允许监测或测试与元件(1,3)之间和之间的连接。

    ZIF SOCKET FOR CHIP CARRIERS
    8.
    发明申请
    ZIF SOCKET FOR CHIP CARRIERS 审中-公开
    ZIF插座用于芯片运输

    公开(公告)号:WO1986000777A1

    公开(公告)日:1986-01-30

    申请号:PCT/US1985001013

    申请日:1985-05-31

    CPC classification number: H05K7/1007

    Abstract: A ZIF socket for chip carriers is taught. Briefly stated, a chip carrier socket housing (12) has sidewalls (24) which are inwardly pivotable. Accordingly, upon the placement of a chip carrier (14) having conductive leads (22) thereon into the chip carrier housing a retainer lid (10) is placed over the chip carrier and the housing. The retainer lid has a latching portion (20) which interacts with a tab (26) on the outside portion of the movable socket walls such that, upon downward urging of the retainer lid, the movable walls are urged inwards thereby moving contacts contained inside the housing into engagement with the conductive pads on the chip carrier.

    Abstract translation: 教授了用于芯片载体的ZIF插座。 简而言之,芯片承载座壳体(12)具有可向内枢转的侧壁(24)。 因此,当将具有导电引线(22)的芯片载体(14)放置到芯片载体壳体中时,将保持盖(10)放置在芯片载体和壳体上。 保持器盖具有闩锁部分(20),其与可移动插座壁的外侧部分上的突片(26)相互作用,使得在保持器盖的向下推动时,可动壁向内推动,从而移动触点 壳体与芯片载体上的导电焊盘接合。

    CONNECTION BASE
    9.
    发明申请
    CONNECTION BASE 审中-公开
    连接座

    公开(公告)号:WO1997043885A1

    公开(公告)日:1997-11-20

    申请号:PCT/CH1997000184

    申请日:1997-05-12

    Inventor: E-TEC AG

    CPC classification number: H01R13/2421 H01R12/714 H05K7/1069

    Abstract: A releasable connection base for an integrated circuit such as a BGA (Ball Grid Array), a CGA (Column Grid Array), an LGA (Land Grid Array) or a flip-chip, comprising a support (7) with through-holes (13). A metal pin (3) is inserted into each through-hole (13). One end of each pin electrically contacts at least one conductive path (8) of the printed circuit whereas the other end electrically contacts a connecting tab (6) on the mounted electrical component (1) or the other printed circuit. The pins are only loosely longitudinally supported inside the holes (13) between two springs (4, 40) enable slight movement of the pins. Said pins may consist of a rod (3) or a spring (3'). The springs (4, 40) may be replaced with a rubber mat containing parallel electrical wires. A radiator (35) holds the integrated circuit on the base.

    Abstract translation: 用于诸如BGA(球栅阵列),CGA(柱格阵列),LGA(Land Grid Array)或倒装芯片的集成电路的可释放连接基座,包括具有通孔的支撑件(7) 13)。 金属销(3)插入每个通孔(13)中。 每个引脚的一端电连接到印刷电路的至少一个导电路径(8),而另一端与所安装的电气部件(1)或另一个印刷电路上的连接突片(6)电接触。 这些销仅在两个弹簧(4,40)之间的孔(13)内部松散地纵向地支撑,能够使销的轻微移动。 所述销可由杆(3)或弹簧(3')组成。 弹簧(4,40)可以用含有平行电线的橡胶垫代替。 散热器(35)将集成电路保持在基座上。

    SURFACE MOUNT SOCKET FOR AN ELECTRONIC PACKAGE AND CONTACT FOR USE THEREWITH
    10.
    发明申请
    SURFACE MOUNT SOCKET FOR AN ELECTRONIC PACKAGE AND CONTACT FOR USE THEREWITH 审中-公开
    表面安装用于电子包的插座和接触使用

    公开(公告)号:WO1997020454A1

    公开(公告)日:1997-06-05

    申请号:PCT/US1996018206

    申请日:1996-11-13

    CPC classification number: H01R13/2478 H01R12/714 H01R13/2485 H05K7/1084

    Abstract: A socket (6) for an electronic package (2) comprises a dielectric housing (10) having contacts (20) each with a surface mount section (50) extending below a bottom surface (14) of the housing for engagement with a respective circuit trace on a circuit board. The surface mount section (50) of each contact has a convex bottom surface (52) with a shape which simulates at least a lower surface portion of a solder ball, whereby the socket imitates the footprint of a ball grid array package.

    Abstract translation: 一种用于电子封装(2)的插座(6)包括具有触头(20)的电介质壳体(10),每个触头都具有在壳体的底表面(14)下方延伸的表面安装部分(50),用于与相应的电路 跟踪在电路板上。 每个接触件的表面安装部分(50)具有凸形底表面(52),其形状模拟焊球的至少下表面部分,由此插座模仿球栅阵列封装的覆盖区。

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