Abstract:
In this application, a description is given of a passive component comprising two electric connections with a plug-in portion for securing and electrically connecting the component to a printed circuit board, for example an electrolytic capacitor. In accordance with the invention, this component is so constructed that both plug-in portions are provided with two pins, with the plug-in portions being so positioned that the four pins do not extend in a flat plane. By virtue of the measure in accordance with the invention, resoldering of such components can be dispensed with. The use of pins whose length and width are different enables the manual installation of the components in accordance with the invention in the correct position to be simplified.
Abstract:
In an electrical connector for connecting electric terminals (4) of a component (3), especially a semiconductor component, to corresponding connecting leads (5), especially on a printed circuit board (2), there is a spring device (14) with electrically conductive through components (16) between the connecting leads (5) and the movable contacts (8). One end of these through components (16) is connected under pressure to the connecting leads (5) and the other to the contacts (8). The contacts (8) take the form of an end-pivoted pressure lever for the spring device (14).
Abstract:
Owing to the increasing range of functions of the components (28, 32), connecting and control devices can be exposed to damaging thermal loads. In the present device the power component (28) with the high power losses of the components (28, 32) is separated from a printed circuit board (31) which carries only signal processing components (32) and fitted on an inner side (24) of an outer wall (25) of the housing (11) having a high heat radiation capacity with the interposition of a substrate. The substrate (23) takes the form of heat conducting foil and has connector tracks via which the power component (26) is put into contact via a printed circuit board contact plug (28) with signal processing components (32) on the printed circuit board (31) and also via a divisible contact strip (12) with the external connection elements of the electric device. This connecting and control device is preferably fitted in motor vehicles.
Abstract:
DIP carrier assembly comprises carrier (10) having support surface (12) with apertures (13) therethrough to channels (22) in side and bottom of carrier into which DIP leads (4) are formed. Terminals (50) aligned in channels (37) in opposed sidewalls (36) of socket (30) apply releasing force on carrier when DIP leads deflect contact portions (56) of terminals. Release of resilient latch (40, 41) on socket causes ejection of carrier.
Abstract:
An interface apparatus provides an auxiliary interface between an electronic base unit and a circuit card (300). The auxiliary interface apparatus may provide an RF interface between a notebook computer and a PCMCIA circuit card. The auxiliary interface apparatus includes an auxiliary base connector (290) attached to the base unit, an auxiliary card connector (350) attached to the circuit card (300), and an actuator device (250B). The actuator device moves the auxiliary base connector between a first position, in which the auxiliary base connector does not make contact with the auxiliary card connector, and a second position, in which the auxiliary base connector does make contact with the auxiliary card connector. The actuator device preferably includes a rack (270B) and a pinion gear (280B).
Abstract:
Electrical circuits can be built up in three dimensions by using spacers (20, 20') which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks (120) which have a number of continuous tracks (110). Link members (126, 128) are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission stacks.
Abstract:
An electrical connector device (5) for use in providing electrical connections between two circuit elements (1, 3) such as an integrated circuit device (1) and a printed circuit board (3), comprises a housing (6) carrying a plurality of switching arrangements each comprising terminals (8, 9) for connection to the two elements (1, 3) respectively, and a switching element (11) adapted and arranged to proved selective connections to either one of the terminals (8, 9) or between the two terminals (8, 9) thereby permitting monitoring or testing of connections to and between the elements (1, 3).
Abstract:
A ZIF socket for chip carriers is taught. Briefly stated, a chip carrier socket housing (12) has sidewalls (24) which are inwardly pivotable. Accordingly, upon the placement of a chip carrier (14) having conductive leads (22) thereon into the chip carrier housing a retainer lid (10) is placed over the chip carrier and the housing. The retainer lid has a latching portion (20) which interacts with a tab (26) on the outside portion of the movable socket walls such that, upon downward urging of the retainer lid, the movable walls are urged inwards thereby moving contacts contained inside the housing into engagement with the conductive pads on the chip carrier.
Abstract:
A releasable connection base for an integrated circuit such as a BGA (Ball Grid Array), a CGA (Column Grid Array), an LGA (Land Grid Array) or a flip-chip, comprising a support (7) with through-holes (13). A metal pin (3) is inserted into each through-hole (13). One end of each pin electrically contacts at least one conductive path (8) of the printed circuit whereas the other end electrically contacts a connecting tab (6) on the mounted electrical component (1) or the other printed circuit. The pins are only loosely longitudinally supported inside the holes (13) between two springs (4, 40) enable slight movement of the pins. Said pins may consist of a rod (3) or a spring (3'). The springs (4, 40) may be replaced with a rubber mat containing parallel electrical wires. A radiator (35) holds the integrated circuit on the base.
Abstract:
A socket (6) for an electronic package (2) comprises a dielectric housing (10) having contacts (20) each with a surface mount section (50) extending below a bottom surface (14) of the housing for engagement with a respective circuit trace on a circuit board. The surface mount section (50) of each contact has a convex bottom surface (52) with a shape which simulates at least a lower surface portion of a solder ball, whereby the socket imitates the footprint of a ball grid array package.