GRINDING OR POLISHING DEVICE AND METHOD FOR TREATING OF A WORKPIECE

    公开(公告)号:WO2021167445A1

    公开(公告)日:2021-08-26

    申请号:PCT/NL2021/050061

    申请日:2021-02-01

    Abstract: The invention relates to a grinding or polishing device and a method for treating a workpiece, wherein the grinding or polishing device comprises a tool holder for holding a grinding or polishing tool and a mounting head for mounting the tool holder to a multi-axis manipulator, 5 wherein the tool holder is rotatable with respect to the mounting head about a pivot axis, wherein the grinding or polishing device further comprises a sensor for converting at least one parameter indicative of an angular position of the tool holder about the pivot axis into an output signal 10 that can be used for determining a control signal for controlling the multi-axis manipulator.

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