公开(公告)号：WO02081996A3

公开(公告)日：2002-12-12

申请号：PCT/US0210110

申请日：2002-04-03

Applicant: UNIV MARYLAND

Inventor： JOSHI YOGENDRA ,  MURTHY SUNIL S ,  NAKAYAMA WATARU

IPC: F28D15/02 ,  F28F13/18 ,  H01L23/427

CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D2015/0216 ,  F28F13/187 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28) in hydraulic communication with a peripheral condenser (30), both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator (28) substantially full at all orientations while leaving a void for accumulation of vapor in the condenser (30). A cover plate (24) and a parallel base plate (22) of generally similar dimension form the evaporator (28) and condenser (30). Optionally, an opening in the base plate (22) is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate (22) may be formed with the electronics package from a single piece of material. A boiling enhancement structure (34)is provided in the evaporator (30) to encourage vapor bubble nucleation.

Abstract translation: 用于增强基本上或完全独立于取向的电子电路组件冷却的装置。 安装到电子组件的薄型热虹吸散热器（20）包括与外围冷凝器（30）液压连通的中央蒸发器（28），两者至少部分地填充有液体冷却剂。 导致非常高的有效导热率。 通过保持蒸发器（28）在所有取向基本满的同时留下空间用于蒸气在冷凝器（30）中的积聚来优化性能。 大致类似尺寸的盖板（24）和平行底板（22）形成蒸发器（28）和冷凝器（30）。 可选地，底板（22）中的开口相对于电子装置封装被密封并且使散热部件与液体冷却剂直接接触。 或者，底板（22）可以由单件材料形成电子封装。 在蒸发器（30）中提供沸腾增强结构（34）以促进气泡成核。