Abstract:
A structure for transferring heat from a heat producing element to a heat sink includes a first layer including a first flat heat pipe array of a substantially parallel and adjacent heat pipes for conveying heat substantially along a first array axis and configured to be thermally coupled to the heat producing element. A second layer includes a second flat heat pipe array of substantially parallel and adjacent heat pipes for conveying heat substantially along a second array axis. The first flat heat pipe array and the second flat heat pipe array partially overlap and are in thermal contact. The first array axis and the second array axis form a nonzero angle, so that the second flat heat pipe array extends beyond the first flat heat pipe array. The second flat heat pipe array is configured to be thermally coupled to the heat sink.
Abstract:
An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of 5 multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted.
Abstract:
Die vorliegende Erfindung bezieht sich auf eine Vorrichtung und ein Verfahren zur Kühlung einer supraleitenden Maschine (2), bei welchen wenigstens zwei Kondensorräume (18, 18',18' ') jeweils mit einem Kaltkopf (16, 16', 16' ') in thermischen Kontakt stehen und bei welchen die wenigstens zwei Kondensorräume (18, 18', 18' ') jeweils eine Verbindungsleitung (20, 20', 20' ') aufweisen, über welche die wenigstens zwei Kondensorräume (18, 18', 18' ') fluidisch mit einem Verdampferraum (12) in Verbindung stehen. Über einen Temperatur- und damit verbundenen Druckunterschied in den wenigstens zwei Kondensorräumen (18, 18', 18' ') ist ein flüssiges Kühlfluid k von wenigstens einem Kondensorraum (18, 18', 18' ') in den Verdampferraum (12) beweg- bzw. pumpbar.
Abstract:
A passive thermal system for use in aerospace vehicles includes a plurality of core-bearing radiator panels having at least one heat pipe embedded therein. The portion of the heat pipe embedded in each panel is fluidically coupled to the portions of the heat pipe in the other core-bearing radiator panels.
Abstract:
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28) in hydraulic communication with a peripheral condenser (30), both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator (28) substantially full at all orientations while leaving a void for accumulation of vapor in the condenser (30). A cover plate (24) and a parallel base plate (22) of generally similar dimension form the evaporator (28) and condenser (30). Optionally, an opening in the base plate (22) is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate (22) may be formed with the electronics package from a single piece of material. A boiling enhancement structure (34)is provided in the evaporator (30) to encourage vapor bubble nucleation.
Abstract:
A pin fin heat exchanger including a pin fin heat pipe. A main tube of the heat pipe may divide at the evaporator end into a number of pin fin evaporators, each having fluid entrances and exits to the main tube; and at the condenser end into a number of pin fin condensers, each having fluid entrances and exits to the main tube.