公开(公告)号：WO0120346A3

公开(公告)日：2001-11-22

申请号：PCT/US0025406

申请日：2000-09-15

Applicant: UT BATTELLE LLC

Inventor： DATSKOS PANAGIOTIS G ,  RAJIC SLOBODAN ,  DATSKOU IRENE ,  EGERT CHARLES M DI

IPC: G01J5/40 ,  H04N5/33 ,  G01J1/00 ,  G01J5/00 ,  G01J5/10

CPC classification number: G01J5/40 ,  H04N5/33

Abstract: A micromechanical sensor and method for detecting electromagnetic radiation involve producing photoelectrons from a metal surface in contact with a semiconductor. The photoelectrons are extracted into the semiconductor, which causes photo-induced bending. The resulting bending is measured, and a signal corresponding to the measured bending is generated and processed. A plurality of individual micromechanical sensors can be arranged in a two-dimensional matrix for imaging applications.

Abstract translation: 用于检测电磁辐射的微机械传感器和方法涉及从与半导体接触的金属表面产生光电子。 光电子被提取到半导体中，这引起光诱导的弯曲。 测量所得到的弯曲，产生并处理与所测量的弯曲相对应的信号。 可以将多个单独的微机械传感器布置在用于成像应用的二维矩阵中。