THIN-FILM DEVICES AND FABRICATION
    1.
    发明申请
    THIN-FILM DEVICES AND FABRICATION 审中-公开
    薄膜器件和制造

    公开(公告)号:WO2016105549A2

    公开(公告)日:2016-06-30

    申请号:PCT/US2015/000411

    申请日:2015-12-24

    CPC classification number: H01L27/1443 G02F1/1523 G02F1/153 G02F1/155

    Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

    Abstract translation: 描述了薄膜装置,例如用于窗户的电致变色装置和制造方法。 特别关注图案化光学器件的方法。 执行各种边缘删除和隔离划线,例如,以确保光学设备具有与任何边缘缺陷的适当隔离。 本文描述的方法适用于具有夹在两个薄膜电导体层之间的一个或多个材料层的任何薄膜器件。 所描述的方法产生新的光学器件配置。

    MITIGATING DEFECTS IN AN ELECTROCHROMIC DEVICE UNDER A BUS BAR
    2.
    发明申请
    MITIGATING DEFECTS IN AN ELECTROCHROMIC DEVICE UNDER A BUS BAR 审中-公开
    减轻母线条下电致变色装置的缺陷

    公开(公告)号:WO2017218705A1

    公开(公告)日:2017-12-21

    申请号:PCT/US2017/037552

    申请日:2017-06-14

    Applicant: VIEW, INC.

    Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

    Abstract translation: 提供用于制造电致变色器件的方法,所述电致变色器件在顶部汇流条下形成短路而不预先确定将在该设备上施加顶部汇流条的位置。 使用这种方法制造的器件可以在顶部母线下面被去激活,或者可以在顶部母线下面包括活性材料。 在顶部母线下方制造具有活性材料的器件的方法包括沉积改性顶部母线,在电致变色器件中制造自修复层,并且在施加母线之前修改器件的顶部透明导电层。

    SACRIFICIAL LAYER FOR ELECTROCHROMIC DEVICE FABRICATION
    3.
    发明申请
    SACRIFICIAL LAYER FOR ELECTROCHROMIC DEVICE FABRICATION 审中-公开
    电致变色器件制造的牺牲层

    公开(公告)号:WO2017210320A1

    公开(公告)日:2017-12-07

    申请号:PCT/US2017/035251

    申请日:2017-05-31

    Applicant: VIEW, INC.

    Abstract: Methods for protecting transparent electronically conductive layers on glass substrates are described herein. Methods include depositing a sacrificial coating during deposition of the transparent electronically conductive layer, before packing the glass substrate for storage or shipping, after unpacking glass substrates from a stack of glass substrates, and/or after a washing operation prior to fabricating an electrochromic stack on the transparent electronically conductive layer. Methods also include removing the sacrificial coating during a washing operation, during tempering, or prior to depositing an electrochromic stack by, e.g., heating the sacrificial coating or exposing the sacrificial coating to an inert plasma.

    Abstract translation: 本文描述了用于保护玻璃基板上的透明电子导电层的方法。 方法包括在沉积透明电子导电层期间,在填充玻璃基板以供存储或运输之前,在从玻璃基板的堆叠中取出玻璃基板之后和/或在制造电致变色堆叠之前的洗涤操作之后沉积牺牲涂层 透明电子导电层。 方法还包括在洗涤操作期间,在回火期间或在沉积电致变色堆叠之前通过例如加热牺牲涂层或将牺牲涂层暴露于惰性等离子体来去除牺牲涂层。

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