公开(公告)号：WO1995021457A1

公开(公告)日：1995-08-10

申请号：PCT/US1995001155

申请日：1995-01-26

Applicant: VLSI TECHNOLOGY, INC.

Inventor： VLSI TECHNOLOGY, INC. ,  BRUGGE, Hunter, Barham

IPC: H01J37/34

CPC classification number: H01J37/3447 ,  H01J37/3408

Abstract: A sputter deposition system (10) includes a mobile collimator (20). The collimator can be magnetically moved into and out of a position between a wafer (28) and a target of material (26) to be sputtered onto the wafer. In addition, magnets (36, 38) are used to levitate the collimator so that it can be removed without solid-solid friction and the contamination it can cause. The magnets used for levitation are part of a control loop that maintains the orientation of the collimator parallel to the wafer. The system alllows for a combination of good deposition step coverage and high fabrication throughput while minimizing opportunities for contamination and breakage that can occur when the wafer is transferred between chambers (12).

Abstract translation: 溅射沉积系统（10）包括移动准直器（20）。 准直器可以被磁性地移入和移出晶片（28）和材料（26）的靶之间，以溅射到晶片上。 此外，磁体（36,38）用于悬浮准直器，使得其可以被移除而没有固体 - 摩擦和它可能引起的污染。 用于悬浮的磁体是保持准直器平行于晶片的取向的控制回路的一部分。 该系统适用于良好的沉积步骤覆盖和高制造生产量的组合，同时最小化当晶片在室（12）之间转移时可能发生的污染和断裂的机会。