专利检索 ap:("WATLOW ELECTRIC MANUFACTURING COMPANY") AND inv:"TOMPKINS, Timothy, B." 第 1 页

1.

发明申请
TEMPERATURE SENSING SYSTEM FOR ROTATABLE WAFER SUPPORT ASSEMBLY 审中-公开
标题翻译：可旋转晶圆支撑组件的温度传感系统

公开(公告)号：WO2017139353A1

公开(公告)日：2017-08-17

申请号：PCT/US2017/016975

申请日：2017-02-08

申请人： WATLOW ELECTRIC MANUFACTURING COMPANY

发明人： NOSRATI, Mohammad , TOMPKINS, Timothy, B.

IPC分类号： G01K1/02

CPC分类号： H01L21/67248 , G01K1/024 , H01L21/67103 , H01L21/68792

摘要： A semiconductor processing apparatus includes a wafer support assembly, a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly, and a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.

摘要翻译： 半导体处理设备包括晶片支撑组件，集成在晶片支撑组件中的温度传感器，用于测量晶片支撑组件的温度，以及信号传输设备，无线地传输关于通过温度传感器获得温度测量值到外部控制模块。