摘要:
An assembly used in a process chamber for depositing a film on a wafer. A pedestal assembly includes a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal assembly. A raising mechanism separates the lift pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, and a lever rotatably attached to the lift pad bracket. The lever rests on the roller when not engaged with the upper hard stop. When the pedestal assembly moves upwards, the lever rotates about a pin when engaging the upper hard stop and roller, and separates the lift pad from the pedestal by a process rotation displacement.
摘要:
A processing system includes at least one processor having a tank for holding a process liquid. A clean assembly above the tank is provided with an upper housing having at least one upper housing spray nozzle, and a lower housing having at least one lower housing spray nozzle, with the lower housing below the upper housing. A door between the upper housing and the lower housing is movable via an actuator from an open position wherein a load port through the clean assembly is open, to a closed position wherein the load port is closed off. The door largely prevents liquids used in the upper housing from moving down into the process liquid in the tank, and may also improve gas flow in the system.
摘要:
A semiconductor processing apparatus includes a wafer support assembly, a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly, and a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.
摘要:
The present invention provides an apparatus for substrate bevel and backside protection. The apparatus includes a vacuum chuck (103), a protecting apparatus, a gas supplying apparatus (114), a spin actuator (115) and a vertical actuator (113). The vacuum chuck (103) holds and positions a substrate. The protecting apparatus has s base portion and a supporting portion (104). The supporting portion (104) is set close to the substrate (101). The supporting portion (104) has a plurality of injecting ports (107) for delivering gas to the gap (105) and a plurality of releasing ports (108) for releasing the gas out of the gap (105). The base portion has a plurality of gas lines (111) and each gas line (111) is connected to one injecting port (107). The gas supplying apparatus (114) supplies the gas to the gas lines (111) of the protecting apparatus. The plurality of injecting ports (107) delivers the gas to the gap (105) for forming a positive gas pressure in the gap (105), and the gas in the gap(105) serves as a gas curtain to protect the bevel and backside of the substrate(101). The spin actuator (115) drives the vacuum chuck (103) and the protecting apparatus to rotate. The vertical actuator (113) drives the vacuum chuck (103) to move vertically.
摘要:
Implementations described herein protect a chamber components from corrosive cleaning gases used at high temperatures. In one embodiment, a chamber component includes at least a bellows that includes a top mounting flange coupled to a bottom mounting flange by a tubular accordion structure. A coating is disposed on an exterior surface of at least the tubular accordion structure. The coating includes of at least one of polytetrafluoroethylene, parylene C, parylene D, diamond-like carbon (DLC), yttria stabilized zirconia, nickel, alumina, or aluminum silicon magnesium yttrium oxygen compound. In one embodiment, the chamber component is a valve having an internal bellows.
摘要:
An apparatus and a method for removing a film on edge of backside of a wafer. The apparatus includes a vacuum chuck (110) having an inner groove (111) and an outer groove (1113) defined at the peripheral edge of the vacuum chuck (110), an inner sealing ring (1115) disposed in the inner groove (111); and an outer sealing ring (1116) disposed in the outer groove (1113). When the wafer is put on the vacuum chuck (110), the space defined by the wafer and the area of the vacuum chuck (110) encircled by the inner sealing ring (1115) is vacuumized for holding and positioning the wafer on the vacuum chuck (110), and the space defined by the wafer and the area between the inner sealing ring (1115) and the outer sealing ring (1116) of the vacuum chuck (110) is filled with pressurized gas for making the space defined by the wafer and the area between the inner sealing ring (1115)and the outer sealing ring (1116) of the vacuum chuck (110) maintain positive pressure for preventing liquid from getting into the center area of the backside of the wafer.
摘要:
The present invention relates to a method of, and an apparatus for, rinsing materialographic samples. The method includes the steps of: - arranging one or more materialographic samples in a sample holder; - connecting the sample holder (10) to a rotation head of a rinsing device; - placing the sample holder connected to the rotation head in the vessel of the rinsing device; - rotating the sample holder relative to the vessel; - filling the vessel with a rinsing liquid; and - subjecting the materialographic samples in the sample holder to ultrasonic waves.