公开(公告)号：WO2022236028A1

公开(公告)日：2022-11-10

申请号：PCT/US2022/028037

申请日：2022-05-06

Applicant: WOLFSPEED, INC.

Inventor： MARBELL, Marvin ,  PUN, Arthur ,  FISHER, Jeremy ,  ANDRE, Ulf ,  KOMPOSCH, Alexander

IPC: H01L23/498 ,  H01L23/66

Abstract: An RF transistor package includes a metal submount; a transistor die mounted to the metal submount; and a surface mount IPD component mounted to the metal submount. The surface mount IPD component includes a dielectric substrate that includes a top surface and a bottom surface and at least a first pad and a second pad arranged on a top surface of the surface mount IPD component; at least one surface mount device includes a first terminal and a second terminal, the first terminal of the surface mount device mounted to the first pad and the second terminal mounted to the second pad; at least one of the first terminal and the second terminal being configured to be isolated from the metal submount by the dielectric substrate; and at least one wire bond bonded to the at least one of the first pad and the second pad.

公开(公告)号：WO2021225860A1

公开(公告)日：2021-11-11

申请号：PCT/US2021/029848

申请日：2021-04-29

Applicant: WOLFSPEED, INC.

Inventor： FLOWERS, Mitch ,  COHEN, Erwin ,  KOMPOSCH, Alexander ,  WALL, Larry Christopher

IPC: H01L21/77 ,  H01L21/70 ,  H01L21/71

Abstract: A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

公开(公告)号：WO2022260887A1

公开(公告)日：2022-12-15

申请号：PCT/US2022/031541

申请日：2022-05-31

Applicant: WOLFSPEED, INC.

Inventor： WOO, Eng Wah ,  CHEANG, Samantha ,  KAM, Kok Meng ,  MABELL, Marvin ,  JANG, Haedong ,  KOMPOSCH, Alexander

IPC: H01L23/66 ,  H01L23/538 ,  H01L21/58

Abstract: A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.

公开(公告)号：WO2022103732A1

公开(公告)日：2022-05-19

申请号：PCT/US2021/058582

申请日：2021-11-09

Applicant: WOLFSPEED, INC.

Inventor： MARBELL, Marvin ,  NAVA, Melvin ,  FISHER, Jeremy ,  KOMPOSCH, Alexander

IPC: H01L23/66 ,  H05K1/18 ,  H05K3/46 ,  H01L23/367 ,  H03F1/00 ,  H01L25/16 ,  H01L23/00

Abstract: A radio frequency (RF) transistor amplifier includes a package submount, a package frame comprising an electrically insulating member and one or more conductive layers on the package submount and exposing a surface thereof, a transistor die on the surface of the package submount and comprising respective terminals that are electrically connected to the package frame, a protective member covering the transistor die, and one or more electrical components that are attached to the package frame outside the protective member. Related RF power device packages and fabrication methods are also discussed.