公开(公告)号：WO2003003068A2

公开(公告)日：2003-01-09

申请号：PCT/US2002/022092

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg ,  OLSON, Ronald

Inventor： TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg ,  OLSON, Ronald

IPC: G02B

CPC classification number: G02B6/4249 ,  G02B6/12002 ,  G02B6/138 ,  G02B6/32 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/38 ,  G02B6/3834 ,  G02B6/3885 ,  G02B6/42

Abstract: A commercial fiber optic connector of a style constructed to accept a ferrule-like unit therein has optical fibers, each having a first part and a second part separated by lengths, a low precision piece having a peripheral shape of a part of the ferrule like unit, two high precision slices each having fiber holes therein. A chamber separates the two high precision pieces defining a volume therebetween. The optical fibers have their first parts within the fiber holes in one of the high precision slices, their second parts within the fiber holes in the other of the high precision slices, and at least some of their length within the volume. The low precision piece and the two high precision slices collectively form the ferrule like unit and the ferrule like unit is contained substantially within the connector housing. A method of making a commercial optical connector involves making a first plate having holes, each larger than a cross sectional area of an optical fiber; making a second plate having holes each larger than the cross sectional area of the optical fiber; inserting an optical fiber in one of the holes in the first plate and one of the holes in the second plate, forming a ferrule component by connecting each of the first plate and the second plate to a chamber that separates the first plate from the second plate, and inserting the ferrule component in a ferrule location of the commercial optical connector.

Abstract translation: 被构造成在其中接纳套圈状单元的样式的商用光纤连接器具有光纤，每个光纤具有分开的长度的第一部分和第二部分，具有外围形状的低精度件 套箍状单元的一部分，两个高精度片中的每一个都具有纤维孔。 腔室将两个高精度部件分隔开，从而在两者之间限定体积。 光纤的第一部分在高精度切片之一的纤维孔内，第二部分在另一个高精度切片的纤维孔内，并且其至少一部分长度在体积内。 低精度部件和两个高精度切片共同形成套圈状单元，并且套圈状单元基本上包含在连接器壳体内。 一种制造商用光连接器的方法涉及制造具有孔的第一板，每个孔都大于光纤的横截面积; 制作具有比光纤的横截面积大的孔的第二板; 将光纤插入第一板中的一个孔中和第二板中的一个孔中，通过将第一板和第二板中的每一个连接至将第一板与第二板分隔开的腔室来形成套箍部件 并将套管部件插入商用光连接器的套圈位置。

公开(公告)号：WO2003085433A1

公开(公告)日：2003-10-16

申请号：PCT/US2002/022084

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg

Inventor： TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg

IPC: G02B6/36

CPC classification number: G02B6/4249 ,  G02B6/12002 ,  G02B6/138 ,  G02B6/32 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/38 ,  G02B6/3834 ,  G02B6/3885 ,  G02B6/42

Abstract: A method of forming a guide for light in a high refractive index material involves forming a guiding structure into a surface of the material, treating the material with a reactive gas to cause the wall to become a cladding material (3808) having a relatively low refractive index, and after treating, filling the cavity with an optically transparent material having a refractive index sufficiently above that of the cladding. A light guiding device is also described. The light guiding device has a slab having a high refractive index, a guide located within the slab. The guide has a wall surface covered with a material, derived from the slab, having a first refractive index lower than the high refractive index, and a filler material having a second refractive index sufficiently higher than the first refractive index such that light entering the guide will be directed towards the second end.

Abstract translation: 在高折射率材料中形成导光体的方法包括在该材料的表面上形成引导结构，用反应性气体处理该材料，以使该壁成为具有较低折射率的包层材料（3808） 并且在处理之后，用具有足够高于包层的折射率的光学透明材料填充空腔。 还描述了一种导光装置。 导光装置具有折射率高的板坯，位于板坯内的导轨。 引导件具有覆盖有来自板坯的材料的壁表面，其具有低于高折射率的第一折射率，以及具有足够高于第一折射率的第二折射率的填充材料，使得进入导向器的光 将被引导到第二端。

公开(公告)号：WO2003003066A2

公开(公告)日：2003-01-09

申请号：PCT/US2002/022052

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  TREZZA, John ,  DUDOFF, Greg ,  KANG, Keith ,  OLSON, Ronald

Inventor： TREZZA, John ,  DUDOFF, Greg ,  KANG, Keith ,  OLSON, Ronald

IPC: G02B

CPC classification number: G02B6/4249 ,  G02B6/12002 ,  G02B6/138 ,  G02B6/32 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/38 ,  G02B6/3834 ,  G02B6/3885 ,  G02B6/42

Abstract: An apparatus for use in a commercial fiber optic connector is made up of an assembly of a set of slices, each of the slices having multiple through holes of a specified arrangement. At least some of the through holes on any two adjoining slices are aligned with respect to each other so as to define a conduit between them. A transmission medium is within the holes. A method of making a fiber optic connector adapted to receive a fiber bearing unit is also described. The method involves coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure, coupling the at least two high precision pieces to a low precision piece to form a unit, and housing the unit within a fiber optic connector housing.

Abstract translation: 用于商业光纤连接器的装置由一组切片的组合构成，每个切片具有指定布置的多个通孔。 任何两个相邻切片上的至少一些通孔相对于彼此对准，以便在它们之间限定导管。 传输介质在孔内。 还描述了制造适于接收纤维轴承单元的光纤连接器的方法。 所述方法包括将至少两个高精度件连接在一起，所述至少两个高精度件具有孔，所述孔具有在耦合之后插入其中的光学介质并被固化以形成波导结构，将所述至少两个高精度件联接到低 精密件以形成单元，并将该单元容纳在光纤连接器壳体内。

公开(公告)号：WO2003003064A2

公开(公告)日：2003-01-09

申请号：PCT/US2002/020830

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg ,  OLSON, Ronald

Inventor： TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg ,  OLSON, Ronald

IPC: G02B

CPC classification number: G02B6/4249 ,  G02B6/12002 ,  G02B6/138 ,  G02B6/32 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/38 ,  G02B6/3834 ,  G02B6/3885 ,  G02B6/42

Abstract: An apparatus to accurately hold an optical fiber within a commercial fiber optic connector. The connector has a first high precision slice having multiple holes of a first area and a first alignment opening and a second high precision slice having multiple holes of a second area and a second alignment opening. The holes of the first high precision slice are arranged relative to the first alignment opening so that, when the second high precision slice and the first high precision slice are juxtaposed with one another and the first alignment opening and the second alignment opening are aligned, the holes of the first high precision slice and the holes of the second high precision slice will be offset relative to each other and will define an opening having an area less than a smaller of the first area and second area. The opening is capable of closely constraining an optical fiber inserted therethrough. A method of making a fiber optic connector adapted to receive a fiber bearing unit involves coupling at least two high precision pieces, having misaligned holes relative to each other, together coupling the at least two high precision pieces to a low precision piece to form a unit, inserting optical fibers into the unit, terminating the fibers in the holes, and housing the unit within a fiber optic connector housing.

Abstract translation: 一种在商业光纤连接器内精确地保持光纤的装置。 连接器具有第一高精度切片，其具有第一区域和第一对准开口的多个孔和具有第二区域和第二对准开口的多个孔的第二高精度切片。 第一高精度切片的孔相对于第一对准开口布置，使得当第二高精度切片和第一高精度切片彼此并置并且第一对准开口和第二对准开口对准时， 第一高精度切片的孔和第二高精度切片的孔将相对于彼此偏移，并且将限定具有小于第一区域和第二区域的较小面积的开口。 开口能够紧密地约束插入其中的光纤。 一种制造适于接收纤维轴承单元的光纤连接器的方法包括将至少两个相对于彼此具有不对准孔的高精度件联接在一起，将至少两个高精度件连接到低精度件上以形成单元 将光纤插入到单元中，将光纤端接到孔中，并将该单元容纳在光纤连接器壳体内。

公开(公告)号：WO2003003067A2

公开(公告)日：2003-01-09

申请号：PCT/US2002/022090

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg ,  OLSON, Ronald

Inventor： TREZZA, John ,  KANG, Keith ,  DUDOFF, Greg ,  OLSON, Ronald

IPC: G02B

CPC classification number: G02B6/4249 ,  G02B6/12002 ,  G02B6/138 ,  G02B6/32 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/38 ,  G02B6/3834 ,  G02B6/3885 ,  G02B6/42

Abstract: A method of making a fiber optic connector adapted to receive a fiber bearing unit involves coupling at least one high precision piece, having holes configured to accept an array of optical fibers, to a low precision piece to form a unit, inserting optical fibers into the unit and housing the unit within a fiber optic connector housing, A commercial fiber optic connector of a style constructed to accept a ferrule-like unit therein has a connector housing, at least 36 optical fibers, a low precision piece, and at least one high precision slice having at least 36 fiber holes each adapted to accept one of the optical fibers, the low precision piece and the at least one high precision slice being contained substantially within the connector housing and forming the ferrule like unit.

Abstract translation: 制造适于接纳光纤轴承单元的光纤连接器的方法涉及将至少一个具有配置成接收光纤阵列的孔的高精度件耦合到低精度件以形成 一个单元，将光纤插入该单元并将该单元容纳在光纤连接器壳体内。构造成在其中接纳套圈状单元的风格的商用光纤连接器具有连接器外壳，至少36个光纤，低 精密件和至少一个具有至少36个光纤孔的高精度薄片，每个光纤孔适合于接纳光纤之一，低精度薄片和至少一个高精度薄片基本上被包含在连接器外壳内，并形成象套圈 单元。

公开(公告)号：WO2003003425A1

公开(公告)日：2003-01-09

申请号：PCT/US2002/022089

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  DUDOFF, Greg ,  TREZZA, John

Inventor： DUDOFF, Greg ,  TREZZA, John

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4292 ,  H01L24/95 ,  H01L25/167 ,  H01L27/144 ,  H01L27/156 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/351 ,  H01S5/0201 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/4087 ,  H01S5/423 ,  H01L2924/00

Abstract: A method for creating a hybridized chip having at least one bottom active device (1504) coupled to an electronic chip (1518) includes combining a bottom active optical device and an electronic chip when at least some of the bottom active optical device contacts are not aligned with at least some of the electronic chip contacts. The method involves adding an insulating layer (1506), having a thickness, a first side and a second side, to the bottom active optical device by affixing the first side of the insulating layer to the surface of the bottom active optical device opposite the substrate, forming openings in the insulating layer extending from the second side to the first side at points substantially coincident with the active contacts of the optical device and the electronic chip, making the sidewalls electrically conductive, and connecting the points with the bottom active optical device contacts and the electronic chip contacts with an electrically conductive material.

Abstract translation: 一种用于产生具有耦合到电子芯片（1518）的至少一个底部有源器件（1504））的杂交芯片的方法包括当至少一些底部有源光学器件触点未对准时组合底部有源光学器件和电子芯片 与至少一些电子芯片接触。 该方法包括通过将绝缘层的第一侧固定到底部有源光学器件的与衬底相对的表面，将厚度为第一侧和第二侧的绝缘层（1506）添加到底部有源光学器件 在所述绝缘层中形成开口，所述开口在与所述光学器件和所述电子芯片的所述有源触点基本一致的点处从所述第二侧延伸到所述第一侧，使得所述侧壁导电，并且将所述点与所述底部有源光学器件触点 并且电子芯片与导电材料接触。

公开(公告)号：WO2003003427A1

公开(公告)日：2003-01-09

申请号：PCT/US2002/022293

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  DUDOFF, Greg ,  TREZZA, John

Inventor： DUDOFF, Greg ,  TREZZA, John

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4292 ,  H01L24/95 ,  H01L25/167 ,  H01L27/144 ,  H01L27/156 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/351 ,  H01S5/0201 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/4087 ,  H01S5/423 ,  H01L2924/00

Abstract: A method of creating a hybridized chip having at least one top active device coupled to an electronic chip where a top active device is combined with an electronic chip having electronic chip contacts, when at least some of the top active device contacts are not aligned with at least some of the electronic chip contacts, and each of the at least some top active device contacts has an electrically corresponding electronic chip contact. The method involves creating sidewalls defining openings in the substrate, extending from the first side at the active device contacts to the bottom fo the substrate opposite the first side, at points substantially coincident with the active device contacts; making the sidewalls electrically conductive; and connecting the points and the electronic chip contacts with an electrically conductive material.

Abstract translation: 一种创建混合芯片的方法，其具有耦合到电子芯片的至少一个顶部有源器件，其中顶部有源器件与具有电子芯片触点的电子芯片组合，当至少一些顶部有源器件触点不对准 至少一些电子芯片触点，并且至少一些顶部有源器件触点中的每一个具有电对应的电子芯片触点。 该方法包括在衬底中形成限定开口的侧壁，在与有源器件触点基本一致的点处，从有源器件触点处的第一侧延伸到与第一侧相对的衬底的底部; 使得侧壁导电; 以及用导电材料连接点和电子芯片触点。

公开(公告)号：WO2003003426A1

公开(公告)日：2003-01-09

申请号：PCT/US2002/022291

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  DUDOFF, Greg ,  TREZZA, John

Inventor： DUDOFF, Greg ,  TREZZA, John

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4292 ,  H01L24/95 ,  H01L25/167 ,  H01L27/144 ,  H01L27/156 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/351 ,  H01S5/0201 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/4087 ,  H01S5/423 ,  H01L2924/00

Abstract: A method of integrating a chip with a topside optical chip has at least one optical device, having an active side including an optically active region, a laser cavity having a height, an optically inactive region, a bonding side opposite the active side, and a device thickness. The method involves bonding the optical chip to the electronic chip; appying a substrate to the active side, the substrate having a substrate thickness over the active region in the range of between a first amount and a second amount, and applying an antireflection without a special patterning or distinguishing between the at least one optical laser device and the other device.

Abstract translation: 将芯片与顶侧光学芯片集成的方法具有至少一个光学器件，其具有包括光学活性区域的激活侧，具有高度的激光腔，光学无效区域，与有源侧相反的接合侧，以及 器件厚度。 该方法包括将光学芯片接合到电子芯片; 将衬底附着到所述有源侧，所述衬底在所述有源区上具有在第一量和第二量之间的范围内的衬底厚度，并且在没有特别图案化或区分所述至少一个光学激光器件和 另一个设备。

公开(公告)号：WO2003003420A1

公开(公告)日：2003-01-09

申请号：PCT/US2002/020695

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  DUDOFF, Greg ,  TREZZA, John

Inventor： DUDOFF, Greg ,  TREZZA, John

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4292 ,  H01L24/95 ,  H01L25/167 ,  H01L27/144 ,  H01L27/156 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/351 ,  H01S5/0201 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/4087 ,  H01S5/423 ,  H01L2924/00

Abstract: A method of integrating a chip with a backside active optical chip described. The backside active optical chip has at least one optical device, having an active side, including an optically active region and an optically inactive region each abutting a substrate (102), a bonding side opposite the active side, and a device thickness. The method involves if the substrate has a substrate thickness (t) in excess of 100 microns over the optically active region, thinning the substrate over the optically active region, while leaving at least some substrate over the optically inactive region; bonding the optical chip to the electronic chip (508) using a flip chip process; and creating access ways (510) in the substrate over optically active regions.

Abstract translation: 一种将芯片与背面有源光学芯片集成的方法。 背面有源光学芯片具有至少一个具有活性侧的光学器件，该光学器件包括光学活性区域和每个邻接衬底（102）的光学非活性区域，与有源侧相反的结合侧和器件厚度。 该方法涉及如果衬底在光学活性区域上具有超过100微米的衬底厚度（t），则在光学活性区域上使衬底细化，同时在光学无活性区域上留下至少一些衬底; 使用倒装芯片工艺将光学芯片接合到电子芯片（508）; 以及在光学活性区域上的衬底中创建存取方式（510）。

公开(公告)号：WO2003005085A1

公开(公告)日：2003-01-16

申请号：PCT/US2002/021950

申请日：2002-06-28

Applicant: XANOPTIX, INC. ,  KANG, Keith ,  TREZZA, John

Inventor： KANG, Keith ,  TREZZA, John

IPC: G02B6/32

CPC classification number: G02B6/4249 ,  G02B6/2804 ,  G02B6/32 ,  G02B6/3636 ,  G02B6/3644 ,  G02B6/3652 ,  G02B6/3672 ,  G02B6/3676 ,  G02B6/368 ,  G02B6/3692 ,  G02B6/3696 ,  G02B6/3885

Abstract: An optical unit has multiple optical devices, a collimated coupler disposed relative to the multiple optical devices (1020) so that laser light (608) can be transferred between at least two of the multiple optical devices and the collimated coupler without crosstalk, and a fused glass collimator, disposed within the collimated coupler, having multiple optical fibers (104) arranged in a predetermined arrangement relative to the multiple optical devices so that the number of optical fibers is always equal to or greater than the number of optical devices (502, 504) on a use basis.

Abstract translation: 光学单元具有多个光学器件，相对于多个光学器件（1020）布置的准直耦合器，使得激光（608）能够在多个光学器件中的至少两个与准直耦合器之间传递而没有串扰 布置在准直耦合器内的玻璃准直器具有相对于多个光学装置以预定布置布置的多根光纤（104），使得光纤数量总是等于或大于光学器件（502,504）的数量 ）。