公开(公告)号：WO2019133079A1

公开(公告)日：2019-07-04

申请号：PCT/US2018/050059

申请日：2018-09-07

Applicant: XCERRA CORPORATION

Inventor： TREIBERGS, Valts ,  NELSON, Mitchell

IPC: G01R1/04 ,  G01R1/067

CPC classification number: G01R1/045 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06722 ,  G01R1/06727 ,  G01R1/06772

Abstract: A test socket assembly includes a socket housing having one or more spring probes therein, and a lead frame assembly including one or more cantilever members. The test socket assembly further includes at least one linear spring damper disposed within the socket housing adjacent the lead frame assembly and supporting the cantilever members, the at least one linear spring damper extending from a first end to a second end, the second end disposed adjacent to a second movable end portion of the one or more cantilever members.

公开(公告)号：WO2019231928A1

公开(公告)日：2019-12-05

申请号：PCT/US2019/034204

申请日：2019-05-28

Applicant: XCERRA CORPORATION

Inventor： TREIBERGS, Valts ,  NELSON, Mitchell

IPC: G01R1/073 ,  G01R31/28 ,  G01R1/067

Abstract: A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8 - 12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2 - 4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.