Abstract:
A test socket assembly includes a socket housing having one or more spring probes therein, and a lead frame assembly including one or more cantilever members. The test socket assembly further includes at least one linear spring damper disposed within the socket housing adjacent the lead frame assembly and supporting the cantilever members, the at least one linear spring damper extending from a first end to a second end, the second end disposed adjacent to a second movable end portion of the one or more cantilever members.
Abstract:
A test socket for use with test equipment to test an electronic component is provided. The test socket includes a conductive body (130) defining a plurality of through holes (160), and a plurality of contact elements (170), each of the contact elements extending at least partially through a respective one of the through holes.
Abstract:
The invention relates to a method and a device for measuring electric components, in particular for the high-frequency measurement of said components. The invention is characterized by the use of contact elements that can be displaced between an initial position and a measuring position. In the latter, the respective contact elements lie against a stop of the component and a measuring contact. Said contact elements are retained in supports consisting of electrically insulated material.
Abstract:
A medical consultation support system in which a client computer, such as a personal computer or a terminal of an existing medical support system, is employed to transfer a structured request for consultation from a primary care physician to a supervisory host computer. The structured request may be accompanied by additional information related to the request, such as existing data files containing patient history information, medical image data, laboratory results, pathologies, etc., forming a transmittable, machine-readable collection of information relating to the consultation request. At the supervisory computer, the request is displayed for preliminary review by a receiving staff physician who designates a specialist and retrieves and assembles selected tutorial and background information, including related published articles, tutorial background lessons, practise and protocol documentation, and records of prior consultations which are related to the current consultation request, all of which are stored in one or more databases of medical information accessible to the supervisory host computer. The supervisory computer then transmits the request for consultation, together with at least the identification of the assembled supporting documentation, to the selected specialist for review, and thereafter receives the responsive comment from the selected specialist. The supervisory computer further stores the request for consultation, including the specialist's responsive comment and an indentification of the cited supporting material, as a structured case history item in the database of medical information where it may be accessed for future reference. Each consultation is further stored as a recorded learning event associated with the requesting primary care physician, and used to generate a report of continuing legal education credits earned by the requesting physician while participating in the managed consultation sessions.
Abstract:
A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.
Abstract:
The invention relates to a test device for testing an integrated circuit called circuit to be tested, comprising one of a plurality of housings in a printed circuit called main circuit. The device comprises an insulating membrane of soft material having two opposite surfaces covered by two conductive layers interconnected by via holes and intended to be in contact with the circuit to be tested and the main circuit respectively, under the influence of a pressure exerted during the test. Protrusions are arranged on at least one of the two layers in a predefined pattern as a function of pins, tabs, pads etc. of the circuit to be tested so as to ensure a contact quality between said layer and the circuit (to be tested or the main circuit) having contact with said layer under the influence of said pressing action.
Abstract:
A socket connector and a contact for use in a socket connector is disclosed. The socket connector includes a plurality of contacts arranged in a grid shape and a socket body provided with the respective contacts. The contact includes a first contact piece and a second contact piece out of contact with each other in a first condition and in contact with each other in a second condition. When the first and second contact piece are in conctact with each other, the electric path length is shortened to reduce a self-inductance, thereby allowing the socket connector of the present invention to be used in high frequency application and in test and evaluation sockets.
Abstract:
A testing method and a tester for a semiconductor integrated circuit device comprising a high−speed input/output element, which enable the test of a high−speed I/O element rapidly exceeding 1GHz with a simple board configuration without any alterations the test system for every I/O specification. A load board (3) provided with a loopback path (4) for connecting the external output terminal and external input terminal of a semiconductor integrated circuit device (1) comprising a high−speed input/output element (2) with a transmission line is loaded with the semiconductor integrated circuit device (1). A testing means (5) provided in the semiconductor integrate circuit device (1) and the loopback path (4) are utilized to test the action of the high−speed input/output element (2) in the semiconductor integrated circuit device (1).
Abstract:
The invention relates to a method and a device for measuring electric components (1), in particular for the high-frequency measurement of said components. The invention is characterized by the use of contact elements (16) that can be displaced between an initial position and a measuring position. In the latter, the respective contact elements lie against a stop (3) of the component and a measuring contact (15). Said contact elements (16) are retained in supports (17) consisting of electrically insulated material.
Abstract:
The invention relates to a test device for a semiconductor component, whereby the semiconductor component comprises at least one first contact. The test device comprises at least one second contact for producing an electrical connection with the first contact. The second contact is arranged in a fixed manner relative to the test device.