LOCALLY BONDING MULTI-LAYER ARRAYS
    1.
    发明申请
    LOCALLY BONDING MULTI-LAYER ARRAYS 审中-公开
    局部粘结多层阵列

    公开(公告)号:WO2007125435A1

    公开(公告)日:2007-11-08

    申请号:PCT/IB2007/051053

    申请日:2007-03-26

    CPC classification number: B31D3/0276 B32B5/26 B32B7/14 E06B9/266

    Abstract: In the methods described, a treatment method is employed on a flexible substrate forming a multi-layer array. The method includes providing the flexible substrate; placing a material to be treated on a surface of the flexible substrate; and treating the material with a frequency energy.

    Abstract translation: 在所述方法中,在形成多层阵列的柔性基板上采用处理方法。 该方法包括提供柔性基底; 将待处理的材料放置在柔性基板的表面上; 并用频率能量处理材料。

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