Abstract:
A semiconductor device having a junction field-effect transistor (JFET) (100) includes a substrate (105) having a first-type semiconductor surface (106) including a topside surface (106a), and a top gate (110) of a second-type formed in the semiconductor surface. A first-type drain (120) and a first-type source (115) are formed on opposing sides of the top gate. A first deep trench isolation region (125) has an inner first trench wall (125a) and an outer first trench wall (125b) surrounding the top gate, the drain and the source, and extends vertically to a deep trench depth (139) from the topside surface. A second-type sinker (135) formed in semiconductor surface extends laterally outside the outer first trench wall. The sinker extends vertically from the topside surface to a second-type deep portion which is both below the deep trench depth and laterally inside the inner first trench wall to provide a bottom gate.