Abstract:
A module for immersion cooling of one or more electronic components comprises: a housing, defining a sealable volume, configured to contain the one or more electronic components immersed in a coolant liquid, the coolant liquid being for receiving heat generated by the one or more electronic components; and a first thermal interface, arranged to receive heat from the coolant liquid. The housing comprises a plurality of external walls, at least one of which is adapted to expand in use, so that the first thermal interface cooperates with a second thermal interface, external the module, to allow transfer of heat from the first thermal interface. A cooling system is also provided, comprising the module and a module receiving device.
Abstract:
A fluid conditioner (1) for use in a tank (110) containing computers (130), or other electronic devices, immersed in fluid (F) in the tank (110). The fluid conditioner (1) comprises a housing (10) having a chamber (38), an outlet (14), a heat exchanger (18) located in the chamber (38) of the housing (10), and one or more pumps (16) to pump fluid such that the fluid passes into contact with the heat exchanger (18) in the chamber (38). The heat exchanger (18) has an inlet (30) for cooling medium to enter the heat exchanger (18) and an outlet (32) for cooling medium to exit the heat exchanger (18). In the upright, operational orientation of the fluid conditioner (1), the pump (16) and the heat exchanger (18) are vertically spaced relative to one another and the heat exchanger (18) is located above the outlet (14) of the fluid conditioner (1). In use, fluid (F) is drawn into and through the pumps (16) to be discharged from the pumps (16). The fluid (F) passes into contact with the heat exchanger (18) to thereby cool the fluid (F), and the cooled fluid (F) exits the fluid conditioner (1) via the outlet (14) of the fluid conditioner (1) and passes into the lower region of the tank (110) for circulation through the tank (110).
Abstract:
Subsea cooling assembly comprising a block module for the accommodation of electronics or power components and a cover element. The block module is arranged with at least one recess wherein the electronics or power components is arranged in the at least one recess of the block module for the transfer heat between the electronics or power components and the surrounding sea through the block module. The cover element has outer rim portions arranged to fit with outer rim portions of the at least one recess for closing off the interior of the at least one recess. The block module has at least one strength supporting structure arranged to provide load support to at least a portion of the cover element which is distanced away from the outer rim portions of the cover element.
Abstract:
Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190 °C, as determined according to ASTM D92, and a viscosity of 27 centistokes ("cSt") or less at 40 °C, as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.
Abstract:
A appliance immersion tank system comprising: a generally rectangular tank adapted to immerse in a dielectric fluid a plurality of appliances, each in a respective appliance slot distributed vertically along, and extending transverse to, the long axis of the tank; a primary circulation facility adapted to circulate the dielectric fluid through the tank; a secondary fluid circulation facility adapted to extract heat from the dielectric fluid circulating in the primary circulation facility, and to dissipate to the environment the heat so extracted; and a control facility adapted to coordinate the operation of the primary and secondary fluid circulation facilities as a function of the temperature of the dielectric fluid in the tank.
Abstract:
Two computing elements (1) are located in a tank (2) containing impure water (3), which acts as a coolant. Two electrodes (4) receive electrical power from terminals (5) and supply an electric current to the water (3). Each computing element (1) comprises a housing (11) of generally cuboid shape. Each of the corners of the housing (11) is chamfered such that each of the six cuboid sides has a plane facet (12) and chamfered facets (13, 14). Electrodes (16) are provided in pairs on opposite facets (12). A potential difference is applied to the electrodes (4) and thus between electrodes (16). The electrical conductivity of the water (3) provides current flow through the water to power the computing elements (1), each of which has relatively low power consumption. Communication between computing elements (1) is also effected via the electrodes (16).
Abstract:
A system for cooling a CPU. The system has a tank for holding dielectric coolant in a liquid phase. The CPU is immersed in the coolant. A cover closes the tank. Electric pathways that convey data to/from the CPU traverse the cover. The electric pathways allow the CPU to exchange data with an external device. In this fashion, the CPU can perform data processing functions while being immersed in dielectric coolant.
Abstract:
Subsea transformer enclosure A subsea transformer enclosure is provided. A transformer chamber of the subsea transformer enclosure is adapted to receive a transformer. A pressure compensation device is mounted to the transformer chamber and is adapted to provide pressure balancing between a dielectric liquid in the trans- former chamber and an ambient medium surrounding the subsea transformer enclosure. A bushing chamber is further mounted to the transformer chamber, and a liquid tight seal is provided between the interior of the bushing chamber and the interior of the transformer chamber. The pressure compensation device comprises a first and a second pressure compensator.
Abstract:
An object of the invention is to provide an improved hot melt ink supply system for ink jet apparatus which is especially adapted for use with pigmented hot melt inks. In the representative hot melt ink supply system described in the specification, a first hot melt ink supply reservoir (27) maintains ink in molten condition during operation of the system and a second reservoir (12) mounted with an ink jet head (11) on a movable carriage (10) communicates with the first reservoir (27) through a flexible supply line (36). The ink in the supply line (36) is normally kept in solid condition and, when a reduced level of ink is detected in the second reservoir (12), the supply line (36) is heated to melt the ink in the line and a pump (32) is actuated to transfer ink from the first reservoir (27) to the second reservoir (12). To permit use of pigmented inks, each of the reservoirs (27, 12) is heated to provide a thermal gradient therein so as to maintain convective circulation of the ink. An ink circulation path is provided to cause convective circulation of pigmented ink in the ink jet head (11).