公开(公告)号：WO1996020969A1

公开(公告)日：1996-07-11

申请号：PCT/JP1995002742

申请日：1995-12-27

Applicant: TORAY INDUSTRIES, INC. ,  TOKUNAGA, Atsuto ,  SAWAMURA, Yasushi ,  TANAKA, Masayuki

Inventor： TORAY INDUSTRIES, INC.

IPC: C08G59/62

CPC classification number: C08G59/245 ,  C08G59/621 ,  C08K3/36 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  Y10S524/919 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L61/04 ,  H01L2924/00

Abstract: An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and an inorganic filler, wherein the curing agent (B) is one containing at least two phenolic and/or naphtholic hydroxyl groups in its molecule and the inorganic filler contains silica (C) as the essential ingredient, the silica comprising 1-99 wt.% of synthetic silica and 99-1 wt.% of molten natural silica; and a semiconductor device comprising semiconductor elements sealed therewith. The composition does not cause failure in resin filling, resin peeling, resin streak, stage shift and vent clogging in the molding step. The sealed semiconductor device is excellent in moisture-resistance reliability, high-temperature reliability and soldering resistance.

Abstract translation: 包含环氧树脂（A），固化剂（B）和无机填料的环氧树脂组合物，其中固化剂（B）是在其分子中含有至少两个酚和/或萘基羟基的无机填料， 填料含有二氧化硅（C）作为必要成分，二氧化硅包含1-99重量％的合成二氧化硅和99-1重量％的熔融天然二氧化硅; 以及包括用其密封的半导体元件的半导体器件。 该组合物在成型步骤中不会导致树脂填充，树脂剥离，树脂条纹，阶段移动和排气堵塞的故障。 密封半导体器件的耐湿可靠性，高温可靠性和耐焊接性优异。

公开(公告)号：WO1986002599A1

公开(公告)日：1986-05-09

申请号：PCT/SE1985000418

申请日：1985-10-28

Applicant: BERLY, Arturo

IPC: B44F01/06

CPC classification number: B44F1/063 ,  C09K3/1021 ,  C09K2200/0208 ,  C09K2200/0213 ,  C09K2200/0239 ,  C09K2200/0243 ,  C09K2200/0605 ,  C09K2200/0622 ,  Y10S524/919

Abstract: A composition for simulated lead strips for leaded windows, which composition consists of 50 - 75 weight % binder, 5 - 15 weight % pigment, 5 - 20 weight % oil and 10 - 30 weight % filling, the binder being a polymer binder, chosen among polyvinyl alcohol based adhesives, polyurethan based adhesives and synthetic rubber based adhesives. The pigment is suitably chosen among metal pigments, bronze powder, iron oxide and graphite, or mixtures thereof. The oil consists preferably of a vegetable, drying oil, like linseed oil. The filling is suitably chosen among wood-flour, saw-dust or sand. A preferred composition consists of 65 weight % polyvinyl alcohol based adhesive, 3 weight % iron oxide, 5 weight % aluminium bronze powder, 11 weight % linseed oil and 16 weight % saw-dust.

Abstract translation: 用于铅窗的模拟铅带的组合物，该组合物由50-75重量％粘合剂，5-15重量％颜料，5-20重量％油和10-30重量％填料组成，所述粘合剂是聚合物粘合剂，选择 聚乙烯醇类粘合剂，聚氨酯类粘合剂和合成橡胶类粘合剂。 颜料适当地选自金属颜料，青铜粉，氧化铁和石墨，或其混合物。 油优选由植物油，干燥油，亚麻仁油组成。 填充物适当地选自木粉，锯屑或沙子。 优选的组合物由65重量％的聚乙烯醇基粘合剂，3重量％的氧化铁，5重量％的铝青铜粉，11重量％的亚麻籽油和16重量％的锯屑组成。