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公开(公告)号:WO2021194702A1
公开(公告)日:2021-09-30
申请号:PCT/US2021/020554
申请日:2021-03-02
Applicant: APPLIED MATERIALS, INC.
Inventor: SUBRAMANI, Anantha, K. , KOTRAPPA, Arun, Kumar , KUMAR, Hanish, Panavalappil Kumarankutty , SUNDAR, Ramcharan
IPC: H01J37/32 , H01J2237/20235 , H01J37/32082 , H01J37/32513 , H01J37/32715
Abstract: Embodiments disclosed herein include an RF return assembly. In an embodiment, the RF return assembly comprises a first plate with a flange, where a first hole and a second hole pass through the flange. The RF return assembly may further comprise a second plate over the first plate, and a first body positioned above the flange. In an embodiment, the RF return assembly further comprises a second body positioned below the flange, where the first body is affixed to the second body by a pillar that passes through the first hole. In an embodiment, the RF return assembly further comprises a spring attached between the second plate and the second body, where the spring passes through the second hole, and a conductive band to electrically couple the first body to the flange.
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公开(公告)号:WO2022238621A1
公开(公告)日:2022-11-17
申请号:PCT/FI2022/050314
申请日:2022-05-10
Applicant: PICOSUN OY
Inventor: KILPI, Väinö
IPC: H01J37/32 , C23C16/455 , C23C16/4409 , C23C16/45536 , C23C16/45544 , C23C16/4583 , C23C16/4586 , C23C16/511 , H01J2237/20235 , H01J2237/332 , H01J2237/334 , H01J37/3222 , H01J37/32577 , H01J37/32715 , H01J37/32816 , H01J37/32834 , H01J37/3288 , H01J37/32899 , H01L21/67069 , H01L21/68742 , H01L21/68785
Abstract: A substrate processing apparatus (100), comprising a reaction chamber (50), an outer chamber (80) at least partly surrounding the reaction chamber (50) and forming an intermediate volume (70) therebetween, and a substrate support (40) within the reaction chamber (50), comprising a hollow inner volume (42), wherein the hollow inner volume (42) and the intermediate volume (70) are in fluid communication through a channel (45) extending from the hollow inner volume (42) to the intermediate volume (70).
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