公开(公告)号：WO2021194810A1

公开(公告)日：2021-09-30

申请号：PCT/US2021/022658

申请日：2021-03-17

Applicant: ROGERS CORPORATION

Inventor： NEILL, John Thomas ,  AGAPOV, Rebecca ,  HIMES, Matthew Raymond

IPC: B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B7/12 ,  B32B27/16 ,  B32B5/16 ,  B32B15/16 ,  B32B27/14 ,  B32B2262/0253 ,  B32B2264/02 ,  B32B2264/0257 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2264/107 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/518 ,  B32B2307/54 ,  B32B2307/748 ,  B32B2457/08 ,  B32B27/304 ,  H05K1/0281 ,  H05K1/036 ,  H05K2201/015 ,  H05K2203/065 ,  H05K3/4688

Abstract: In an aspect, a circuit material comprises a multilayer stack comprising alternating layers of a reinforcing layer and a fluoropolymer layer; wherein the fluoropolymer layer comprises a fluoropolymer other than a biaxially-oriented polytetrafluoroethylene; wherein the reinforcing layer comprises a biaxially-oriented polytetrafluoroethylene; and wherein an electrically conductive layer is in direct physical contact with an outer surface of the multilayer stack. In another aspect, an article comprises the circuit material. In yet another aspect, a method of making the circuit material comprises laminating the multilayer stack and the electrically conductive layer to form the circuit material; or laminating a layered stack comprising the conductive layer and alternative layers of the fluoropolymer layers and the reinforcing layer to form the circuit material.