An electrolytic copper foil with a carrier foil furnished with a primer resin layer, that even when the electrolytic copper foil with a carrier foil at its surface to be bonded with a substrate resin layer has low surface roughness, exhibits high adherence, and that when pinholes, etc. remain in the bulk copper layer, or when the inside wall part of through-holes, via holes, etc. is brought into contact with a desmear solution, allows any detachment due to erosion between electrolytic copper foil layer and substrate resin layer to be less probable. Thus, there is provided an electrolytic copper foil with a carrier foil furnished with a primer resin layer, comprising a carrier foil and, sequentially superimposed on at least one major surface thereof, a junction interface layer, a bulk copper layer, a Ni-Zn containing plating layer and a primer resin layer, wherein the Ni-Zn containing plating layer contains Ni and Zn in a Ni/Zn adhesion ratio of 1.5 to 10. Further, there is provided a process for producing the same.