The invention belongs to a material used for preparing printed circuit board, more specifically a resin combination and a prepreg used for preparing the printed circuit board. The resin combination uses phenoxy resin, epoxy resin composition, epoxy thinner, amine curing agent, imidazole enhancer and solvent as materials and is prepared in accordance with a certain weight, then the resin combination solution is immersed in glass fiber cloth to make the prepreg. Non-flowing character and the wetting quality of the glass fiber cloth are improved because of the excellent formula of the resin combination, thereby the prepreg used for the printed circuit board has a better non-flowing character, and moisturizing capability, heat resistance, flame retardant, high connectivity with copper foil, and provides high performance material for the printed circuit board product which has a special structure and flexibility-combines with steel.